Vice President Jung Woosuk Delivers Keynote Speech
"AI Computing Era, Opportunities in the Custom Memory Market"
SK Hynix announced on July 2 that it showcased a wide range of AI memory solutions at the '2025 Intel Artificial Intelligence (AI) Summit Seoul' held on July 1 at the Grand InterContinental Parnas in Gangnam-gu, Seoul.
Joo Suk Jung, Vice President of SK Hynix, is delivering the keynote speech at the '2025 Intel Artificial Intelligence (AI) Summit Seoul' held on the 1st at the Grand InterContinental Parnas in Gangnam-gu, Seoul. Photo by SK Hynix
Intel holds the AI Summit annually in 24 major cities around the world to discuss the potential of the AI industry and future strategies. This year, under the theme 'Innovation in AI Development: Designing the Future,' participants shared the latest trends in AI technology and innovative application cases, while also exploring the direction of AI advancement across industries.
At the summit, SK Hynix operated an exhibition booth to introduce memory products and technologies that will lead AI innovation. In particular, the company unveiled the HBM3E (5th generation) 12-layer, which achieves the largest capacity among existing high-bandwidth memory (HBM) products at 36 gigabytes (GB), and the HBM4 (6th generation) 12-layer, which boasts a data processing speed of over 2 terabytes (TB) per second.
In addition, SK Hynix exhibited server memory modules based on DDR5 DRAM, such as RDIMM and MRDIMM, as well as high-density memory module SOCAMM, and CMM (CXL Memory Module)-DDR5, among others.
During the keynote speech at the event, the importance of memory semiconductors in the AI era was emphasized, and the company's future vision was shared. Joo Suk Jung, Vice President in charge of Software Solutions at SK Hynix, stated that as the AI computing era unfolds, market opportunities for custom memory technology are expanding. He also noted that Intel and SK Hynix are closely collaborating in the data center solutions sector.
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