Strengthening Leadership in the HBM Market
SK Hynix introduced the roadmap for its sixth-generation high bandwidth memory (HBM), 'HBM4', at an information technology (IT) exhibition in the United States. Following the fifth-generation HBM3E 12-layer product, the company aims to maintain its technological leadership in the next-generation market as well.
From June 23 to 26, local time, SK Hynix participated in 'HPE Discover 2025' (hereafter HPED), held in Las Vegas, United States, where it shared its technology roadmap and service strategy to lead the era of artificial intelligence (AI), along with its AI cloud vision. HPED is an annual technology conference hosted by the U.S. ICT company Hewlett Packard Enterprise (HPE).
At this year's event, SK Hynix organized its exhibition booth into four sections: HBM, server DIMM (dual in-line memory module), enterprise SSD (eSSD), and CMM (CXL memory module)-DDR5.
In the HBM section, the company showcased its lineup, including the 48GB HBM4 16-layer, 36GB HBM4 12-layer, and 36GB HBM3E 12-layer products. HBM4 is capable of processing more than 2TB of data per second, which is among the fastest speeds in the world, and is expected to be widely adopted in AI semiconductors starting next year. In March of this year, SK Hynix supplied HBM4 12-layer sample products to major customers such as Nvidia and is targeting mass production in the second half of this year. The HBM4 16-layer product, currently under development, will be supplied in line with customer demand, which is expected to be in the second half of next year.
In addition, SK Hynix presented memory modules based on DDR5 DRAM, such as RDIMM and MRDIMM, which utilize the company's sixth-generation (1c) 10nm-class (nanometer, one-billionth of a meter) advanced process technology. The company also introduced high-density memory module SOCAMMs based on LPDDR5X, which enable low power consumption and high performance.
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