The Semiconductor Packaging Industry Expo will be held in Suwon, Gyeonggi Province this August.
On June 23, Suwon City announced that, together with Gyeonggi Province, it will host the "2025 Next-Generation Semiconductor Packaging Industry Expo (ASPS)" at the Suwon Convention Center from August 27 to 29.
This expo will showcase advanced technologies related to semiconductor packaging, including packaging and testing process equipment, materials, components, and technology solutions.
Packaging is the process of manufacturing semiconductor chips into forms suitable for electronic devices, and it is the only way to overcome the limitations of ultra-fine processing.
The Next-Generation Semiconductor Packaging Industry Expo will feature an exhibition, an international forum introducing domestic and global semiconductor packaging trends and technological developments, a semiconductor purchasing consultation event, and company-specific technical seminars.
This year, the Packaging Trend Forum and ISES KOREA 2025 (the Global Semiconductor Executive Summit, August 27-28), which the Suwon Convention Center has attracted for the first time in Korea, will be held simultaneously. Senior executives from global semiconductor companies such as Samsung Electronics, SK hynix, Nvidia, and ON Semiconductor are expected to attend.
At the semiconductor purchasing consultation event, overseas buyers from global semiconductor companies will be invited. The technologies of exhibiting companies will be introduced, providing a foothold for overseas expansion.
Side events will include programs to strengthen international business cooperation, such as a Japanese semiconductor briefing session organized by JETRO (Japan External Trade Organization, Korea Office) and the "Israel Business Briefing" hosted by the Embassy of Israel.
Specialized side events that will attract the attention of semiconductor experts and industry stakeholders will also be held, such as a symposium organized by the SoBuJang Technology Convergence Forum and Research Association and the Korea Micro Packaging Research Association, as well as a conference by the Korea Nano Technology Institute.
Currently, domestic and international exhibitors are being recruited. Participating companies will be provided with one-on-one business consultation opportunities with overseas buyers and support for holding technical seminars.
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