Korea Advanced Materials announced on May 28 that it has signed a technology transfer agreement with the Korea Photonics Technology Institute for "silicon photonics device (Si-AWG) based temperature sensor technology." This technology transfer is part of a strategic partnership aimed at targeting the next-generation precision sensor market, and both organizations plan to accelerate the commercialization of domestic optical sensor technology.
The transferred technology utilizes a silicon-based AWG (Arrayed Waveguide Grating) structure, providing superior precision and reliability compared to conventional electronic temperature sensors.
In particular, this technology transfer includes core manufacturing technologies such as waveguide structure design, PLC FA (Fiber Array) bonding processes, and sensor reliability evaluation. It is expected to serve as a foundation for the development of highly integrated optical sensor devices.
Korea Advanced Materials expects to leverage this technology to develop highly reliable sensor products applicable to various fields, including optical sensors, optical communication modules, and measurement equipment for smart factories.
A representative from Korea Advanced Materials stated, "This technology transfer marks a significant turning point in expanding our core competencies to silicon photonic device processing and packaging," adding, "We will secure competitiveness in high value-added markets such as precision industrial sensors and optical modules for data centers."
Kim Jungho, head of the Optical Sensor Commercialization Research Center at the Korea Photonics Technology Institute, said, "We will continue to provide industry-tailored technology transfers and follow-up support in connection with our ongoing 'fiber-optic-based high-precision measurement sensor development' project," adding, "We aim to contribute to securing global competitiveness in the silicon photonics field and vitalizing the industrial ecosystem."
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
