[Market Focus] YCChem Prepares for Mass Production of Three Core Glass Substrate Materials... Samsung Gears Up for Future Semiconductors with Glass

Semiconductor materials company YCChem is showing strong performance. The company's stock price appears to be influenced by news that Samsung Electronics has begun preparing for the future semiconductor market by adopting glass substrates. Glass substrates are next-generation components that enable the realization of high-performance semiconductors such as artificial intelligence (AI) chips.

As of 9:42 a.m. on May 26, YCChem was trading at 25,350 won, up 13.93% from the previous trading day.

An IT-focused media outlet reported that Samsung Electronics has established a plan to introduce glass substrates in advanced semiconductor packaging by 2028. The core of the plan is to replace the 'silicon interposer' with a 'glass interposer', and this is the first time Samsung Electronics' roadmap for glass substrates has been confirmed.

YCChem is preparing to mass-produce three core materials for glass substrates. Ko Youngmin, a researcher at Daol Investment & Securities, stated, "Currently, we are the sole supplier of three types of photo materials for glass substrates (PR/developer/stripper) to a leading domestic client." He added, "The client has adopted exposure equipment from a leading North American global equipment manufacturer, and the performance of the materials for this equipment has been verified." He further predicted, "As the glass substrate market grows, YCChem is likely to see flexible earnings growth."

Ko emphasized, "Materials for glass substrates are also expected to show significantly higher profitability compared to existing materials, similar to EUV rinses."

YCChem also recently announced that its self-developed 'Extreme Ultraviolet (EUV) Rinse' product has passed mass production evaluation by a global semiconductor company. A company representative explained, "We are currently discussing product supply schedules and other details with global clients," and added, "YCChem will directly supply essential materials for advanced semiconductor manufacturing processes, including high-bandwidth memory (HBM)."

The 'EUV Rinse' supplied by YCChem is designed to prevent pattern collapse or bridging caused by the short wavelength of light sources in the semiconductor EUV process, while also improving resolution, roughness, and sensitivity. The company highlighted that its product can effectively reduce pattern collapse and defects that occur during DRAM processing, which is a key competitive advantage.

This can contribute to improving the final yield in the HBM production process. In the HBM packaging process, where DRAM chips are stacked vertically, the stability of the rinse material is a key factor that directly affects yield.

YCChem is also mass-producing TSV PR (Through Silicon Via Photoresist) materials, which are essential for the HBM process. Based on its technological capabilities and process stability, YCChem plans to secure tangible growth opportunities across next-generation industries such as AI, autonomous driving, and high-performance computing.