Hanmi Semiconductor to Make Debut at SEMICON Southeast Asia, Showcasing World-Leading Technology

Hanmi Semiconductor announced on May 16 that it will participate in the '2025 SEMICON Southeast Asia (SEA)' exhibition, which will be held at the Sands Expo & Convention Centre in Singapore from May 20 to 22, to showcase its world-leading equipment.

SEMICON is the world's largest specialized semiconductor industry exhibition, organized by the international Semiconductor Equipment and Materials International (SEMI). It is held annually in different regions, featuring the latest semiconductor technologies, equipment, materials, and related solutions. SEMICON SEA has mainly been held in Malaysia, but this year, marking its 30th anniversary, it will take place in Singapore. Hanmi Semiconductor has participated as an official sponsor in SEMICON Korea, SEMICON China, and SEMICON Taiwan every year. This is the company's first time participating in SEMICON SEA.

Hanmi Semiconductor will primarily introduce its TC Bonder for HBM production, which holds the top global market share. The Hanmi Semiconductor TC BONDER 1.0 GRIFFIN SB is equipment used in the production of cutting-edge high bandwidth memory HBM3E 8-layer and 12-layer products. Hanmi Semiconductor commands over 90% market share in the advanced HBM3E sector.

In addition, the company plans to actively promote its '7th Generation New Micro SAW & VISION PLACEMENT 6.0 GRIFFIN,' which offers improved precision over previous generations, to major global clients. Hanmi Semiconductor's MSVP equipment has maintained the number one global market share since the mid-2000s.

The equipment integrates the entire process, from precision cutting of semiconductor packages to cleaning, drying, high-resolution 2D/3D vision inspection, quality sorting, and automatic stacking. The 7th generation introduces new features such as BladeChangeMaster, Auto Kit Change, and Full Self Device Setup, which are unmanned automation technologies. These additions help reduce management costs associated with equipment operation compared to previous generations.

Hanmi Semiconductor will also introduce its 'TC BONDER 3.0CW' equipment, a 2.5D packaging bonder that attaches AI GPUs and HBM semiconductors to silicon interposers.

A Hanmi Semiconductor representative stated, "Singapore plays a crucial role in the global AI semiconductor supply chain, as evidenced by the groundbreaking of a new HBM packaging plant by the US semiconductor company Micron Technology in the Woodlands area earlier this year. By participating in SEMICON SEA, we plan to actively promote Hanmi Semiconductor's advanced equipment technology in the Southeast Asian market and further strengthen our partnerships with local clients."

Founded in 1980, Hanmi Semiconductor is a global company with approximately 320 clients worldwide, leveraging its unrivaled experience and expertise in the global semiconductor market. The company also plans to participate as an official sponsor in the SEMICON exhibition to be held in Taipei, Taiwan in September, continuing its ongoing global marketing efforts.