Hanwha Semitech Captures SK Hynix... 42 Billion KRW Orders in One Month

Hanwha Semitek signs TC Bonder contract for SK Hynix HBM manufacturing
Contract worth 21 billion KRW... Secures another order of the same scale within half a month
Achieves 42 billion KRW in orders within a month of entering the market

Hanwha Semitek has signed an additional semiconductor equipment supply contract with SK Hynix for high bandwidth memory (HBM) manufacturing. After passing the final stage of quality verification (Qualtest) in mid-month and signing a full-scale supply contract, the company secured another contract of the same scale within half a month, achieving orders worth 42 billion KRW.

Hanwha Semitek announced on the 27th that it signed a contract with SK Hynix to supply equipment for HBM manufacturing. The contract amount is 21 billion KRW, and the company will supply TC Bonder (thermal compression bonding equipment) by July this year. The TC Bonder is equipment that attaches processed chips to circuit boards using a thermal compression bonding method, which is a key process in HBM manufacturing.

Hanwha Semitech's TC Bonder 'SFM5-Expert'. Provided by Hanwha Semitech

Hanwha Semitek also signed the same contract with SK Hynix on the 14th of this month. Although the industry considers this not a large-scale contract compared to typical equipment supply agreements, the ripple effect of consecutive contracts is expected to be significant. It has created a crack in the TC Bonder supply chain for SK Hynix, which has been virtually monopolized by Hanmi Semiconductor, and there are forecasts that it could even shake up the domestic materials, parts, and equipment market in the future.

A Hanwha Semitek official stated, "Following our first market entry this month, we have secured additional orders," adding, "This is another recognition of our technological capability and quality excellence, and we will continue to expand our market presence."