Hanmi Semiconductor Chairman Gwak Dong-shin Acquires 3 Billion Won of Company Shares... 'Confidence as the World's Best TC Bonder'

Hanmi Semiconductor announced on the 17th that Chairman Gwak Dong-shin will acquire an additional 3 billion KRW worth of treasury shares following his purchase in February.

The acquisition is scheduled for the 15th of next month and will be conducted on the open market. Since 2023, Chairman Gwak Dong-shin will have personally acquired treasury shares worth a total of 42.3 billion KRW, increasing his stake from 33.97% to 34%.

Chairman Gwak Dong-shin of Hanmi Semiconductor, the leading TC bonder company holding over 90% market share in the global HBM3E 12-layer market, stated, "I believe there is a significant technological gap compared to latecomers such as ASMPT and Hanwha Semitek," and confidently added, "Hanmi Semiconductor's TC bonder has world-class competitiveness."

He introduced, "With the growth of the AI semiconductor market led by NVIDIA, demand for TC bonder equipment for HBM continues to increase explosively this year." Furthermore, he said, "Hanmi Semiconductor, which has global customers including SK Hynix and Micron Technology, plans to ship more than 300 TC bonders this year without any setbacks, based on 45 years of experience, over 120 patents for HBM equipment, and the world's largest HBM TC bonder production capacity."

Chairman Gwak added, "Following the HBM3E 12-layer equipment currently supplied to major customers, Hanmi Semiconductor is preparing to launch a new product, the FLTC bonder (fluxless type), in the second half of this year," and "Hybrid bonding equipment is also under development according to schedule."

Chairman Gwak's acquisition of treasury shares reflects his confidence in Hanmi Semiconductor TC bonder's technological capabilities and future growth in the HBM equipment market.

To expand supply in line with TC bonder equipment demand, Hanmi Semiconductor is establishing a semiconductor equipment production cluster covering a total area of 89,530㎡ (27,083 pyeong) in the Juan National Industrial Complex, Seo-gu, Incheon. The 7th plant, which began construction in January, is expected to be completed in the fourth quarter of this year and will produce AI 2.5D package big-die TC bonders, new fluxless bonders for next-generation HBM4 production, and hybrid bonders scheduled for release this year.

According to market research firm TrendForce, the global HBM market size is expected to surge 157% from 18.2 billion USD (approximately 26 trillion KRW) in 2024 to 46.7 billion USD (approximately 68 trillion KRW) in 2025. Market research firm Gartner reported that HBM sales accounted for 13.6% of the total DRAM market last year and are projected to reach 30.6% by 2028.

Founded in 1980, Hanmi Semiconductor is a semiconductor equipment company with approximately 320 global customers. Since establishing its Intellectual Property Department in 2002, the company has focused on protecting and strengthening intellectual property rights, filing over 120 patents related to HBM equipment to date.