Hanmi Semiconductor Holds Groundbreaking Ceremony for 7th Factory of HBM TC Bonder

Hanmi Semiconductor announced on the 6th that it held a groundbreaking ceremony for its 7th factory for high-bandwidth memory (HBM) TC bonders.

The 7th factory is a two-story building with a total floor area of 4,356 pyeong and will be used as a TC bonder manufacturing plant producing high-spec HBM with 12 or more tiers of HBM3E supplied to NVIDIA and Broadcom.

Hanmi Semiconductor, which holds the No. 1 global market share in TC bonders for HBM production, has secured a total HBM TC bonder production line area of 27,083 pyeong. Based on sales, it can produce up to 2 trillion KRW worth of products.

Chairman Kwak Dong-shin of Hanmi Semiconductor explained, "The global HBM market is explosively increasing every year due to the rapid growth of the artificial intelligence (AI) market," adding, "The AI market size is expected to grow exponentially." He continued, "More than 90% of the HBM3E 12-tier used by NVIDIA and Broadcom, which currently lead the global AI market, are produced using Hanmi Semiconductor equipment," and added, "Hanmi Semiconductor is also expected to grow rapidly."

Chairman Kwak said, "The 7th factory is scheduled to be completed in the fourth quarter of this year and was constructed to secure production capacity ahead of HBM market demand," explaining, "It will produce TC bonders for HBM production, big-die TC bonders for AI 2.5D packages to be launched this year, new products such as fluxless bonders for next-generation HBM4 production, and hybrid bonders."

He expressed gratitude, saying, "I am always thankful to the 800 employees of Hanmi Semiconductor who are wholeheartedly working to achieve this year's sales target of 1.2 trillion KRW and next year's goal of 2 trillion KRW," and added, "I believe that the role of a CEO is to create a better company for the employees."

According to recent market research firm TrendForce, the global HBM market size is expected to surge by 157% from 18.2 billion USD (about 27 trillion KRW) in 2024 to 46.7 billion USD (about 69 trillion KRW) in 2025.

Hanmi Semiconductor signed a trust contract for acquiring treasury shares worth 200 billion KRW last year alone. It also canceled treasury shares worth a total of 57 billion KRW in two rounds. Over the past three years, it has signed trust contracts for acquiring treasury shares worth a total of 280 billion KRW, striving to enhance shareholder value. Chairman Kwak personally has shown confidence in Hanmi Semiconductor's future value by directly acquiring treasury shares worth approximately 37.3 billion KRW in the market from 2023 to the present.

Founded in 1980, Hanmi Semiconductor is a global company with about 320 customers worldwide, based on its unparalleled experience and know-how in the global semiconductor market. Since establishing its Intellectual Property Department in 2002, it has focused on protecting and strengthening intellectual property rights with a team of about 10 specialists, filing over 120 patents related to HBM equipment to date. Its outstanding technology and durability are expected to further enhance the competitiveness of its equipment.