Research on Predicting Material Removal Rate in Semiconductor Chemical Mechanical Planarization Process Using Artificial Intelligence
Dong-A University (President Lee Hae-woo) announced on the 5th that students from the Department of Mechanical Engineering received the Grand Prize at the ‘2024 Korean Society of Manufacturing Process Engineers Capstone Design and Creative Idea Competition’.
A student team from the Department of Mechanical Engineering at Dong-A University is posing for a commemorative photo after receiving the Grand Prize at the 'Capstone Design and Creative Idea Competition.' Provided by Dong-A University
At the competition held on the 28th of last month at the Grand Hyatt Hotel in Jeju City, a team composed of undergraduate students from Dong-A University’s Department of Mechanical Engineering (Ha In-cheol, Kim Seung-woo, Lee Seung-min, Kim Young-woong, Heo Seong-jae) won with their project titled ‘Prediction of Material Removal Rate Using ANN in SiO2 CMP Process’.
A total of 65 teams from universities nationwide participated in this competition, and the final winners were selected through oral presentations in the finals by teams that passed the preliminary poster presentation.
The Dong-A University mechanical engineering team has been participating in the ‘PNP (Pull-aNd-Push)’ program supported by Dong-A University’s ‘SW-Centered University Project’ since May, conducting research on ‘Prediction of Material Removal Rate in Semiconductor Chemical Mechanical Planarization Process Using Artificial Intelligence’.
Professor Lee Hyun-seop, who supervised the mechanical engineering PNP program, said, “Despite everyone being busy, the fact that they met weekly in the laboratory over the past seven months to study and research step-by-step from the basics and presented their work to receive such a good evaluation is entirely due to the students’ diligence.”
Ha In-cheol, the student who gave the presentation, said, “Participating in the SW-Centered University Project program allowed me to learn about the use of AI/SW in mechanical engineering, which I believe will be very helpful for my future career.”
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