ASML Targets Semiconductor EUV Demand Growth by 2030 with Sales Up to 89 Trillion KRW

'2024 Investor Day' in Bonn, Netherlands

ASML, the world's only manufacturer of extreme ultraviolet (EUV) lithography equipment, announced on the 14th that it aims to achieve annual sales of approximately 44 to 60 billion euros (about 65 to 89 trillion KRW) by 2030, driven by increased EUV demand due to the AI boom. Last year, the company recorded sales of 27.6 billion euros (about 41 trillion KRW).

On the same day, ASML held its '2024 Investor Day' at its headquarters in Veldhoven, Netherlands, announcing that its gross profit margin target is approximately 56 to 60%.

Christoph de Jager, CEO, stated, "ASML is equipped to expand EUV technology over the next decade and broaden its lithography portfolio, which involves engraving circuits on wafers. We will leverage the opportunities brought by artificial intelligence (AI) to enhance profitability."

ASML expects that the increase in demand for AI and high-performance semiconductors will drive productivity and innovation in the semiconductor industry. The company forecasts that the global semiconductor market will grow to a scale of 1 trillion dollars (about 1,405 trillion KRW) by 2030, with an average annual growth rate of about 9% from next year through 2030.

ASML Targets Semiconductor EUV Demand Growth by 2030 with Sales Up to 89 Trillion KRW

Christoph Pueke, CEO of ASML. Photo by ASML

ASML anticipates that the number of processes using EUV lithography equipment will continue to increase until 2030, leading to a surge in demand for this equipment. The scale of customer investments in advanced logic and DRAM EUV lithography is estimated to grow at a double-digit annual rate from 2025 to 2030. ASML exclusively supplies extreme ultraviolet (EUV) lithography equipment to companies such as Samsung Electronics and TSMC.

Although EUV equipment has a high price per unit, it reduces the number of patterning steps compared to legacy equipment, thereby lowering wafer production costs and time. Previously, multiple exposures (multi-patterning) were required to create complex patterns, but with advancements in EUV technology, a single exposure (single-patterning) is now sufficient to produce detailed patterns.

ASML believes that as EUV technology further improves cost efficiency, its customers will shift from complex multi-patterning to single-patterning exposure in advanced logic and DRAM. The company analyzes that customers will be able to further transition multi-patterning layers to single-patterning EUV 0.33 NA and EUV 0.55 NA in the future.

Roger Dassen, ASML’s Chief Financial Officer (CFO), said, "Strong demand for our products and services will continue due to growth in the semiconductor market and increased investment in leading-node lithography. We plan to maintain double-digit annual sales growth from 2025 to 2030 and continue to provide substantial cash returns to shareholders through increased dividends and share buybacks."