[Featured Stock] ASIC Land Adds Aegis Technology to TSMC's 'Advanced Process'... Targeting AI Data Centers

Collaboration with Taiwan Aegis Technology on Global AI Server Chip Co-Development
Targeting High-Performance Data Center Market with Advanced IO Chiplet Solutions

ASIC Land is showing strong performance. The news that it is targeting the high-performance data center market in partnership with Taiwan's Aegis Technology appears to be influencing its stock price.

As of 9:19 AM on the 6th, ASIC Land is trading at 42,950 KRW, up 4.76% from the previous day.

ASIC Land, a leading company in ASIC (Application-Specific Integrated Circuit) design solutions, announced that it has signed a strategic partnership agreement with Aegis Technology, a next-generation artificial intelligence (AI) and high-performance computing semiconductor solutions company, to jointly develop AI HPI (High-Performance Computing) server chips.

The goal of the agreement is to target the high-performance data center market by providing advanced IO (Input/Output) chiplet solutions. Specifically, the collaboration will cover several core technologies including CPU chips, AI chips, IO chips, IP licenses (UCIe, LPDDR5, PCIE5/6), and advanced CoWoS packaging development.

ASIC Land plans to focus on developing IO chips by combining its ASIC chip design expertise, TSMC's advanced process technology, and Aegis's UCIe and LPDDR5 IP technologies. Starting in Korea, the companies aim to expand into overseas markets to enhance their global competitiveness.

Aegis provides semiconductor solutions suitable for next-generation AI and high-performance computing technologies and is increasing its competitiveness in the global market through innovative technologies such as chiplet architecture. It continuously strengthens its technological capabilities through collaborations with Arm, AI server solutions, and its proprietary high-speed interface IP technologies including UCIe.

Jongmin Lee, CEO of ASIC Land, stated, "Through the partnership with Aegis, we plan to strengthen the core technologies needed in the high-performance data center market and enhance our competitiveness in the global market," adding, "We will continue to strengthen cooperation with global partners and showcase unparalleled technological capabilities that can respond to advanced semiconductor processes."