US California 'OIP 2024 Forum'
Emphasizing Tripartite Cooperation with Nvidia and TSMC
On the 25th (local time), Lee Byung-do, TL of SK Hynix, is presenting at the OIP Partner Technical Talk, a side event of the 'TSMC Open Innovation Platform (OIP) Forum 2024' held in Santa Clara, California, USA. [Photo by SK Hynix]
SK Hynix participated for the first time in the global semiconductor event hosted by Taiwan's TSMC, the world's largest foundry company, showcasing its collaborative achievements with NVIDIA.
On the 25th (local time), SK Hynix exhibited its HBM3E and NVIDIA H200 chipset boards side by side at the 'TSMC Open Innovation Platform (OIP) Forum 2024' held in Santa Clara, California, USA. The chipset manufacturer is TSMC, the event host, demonstrating the triangular cooperation among customer companies, foundries, and memory companies.
This forum is an event organized by TSMC to foster technology development and collaboration with key companies within the semiconductor ecosystem. Major semiconductor companies from around the world participate to showcase new products and technologies.
At the event, SK Hynix opened a booth under the theme 'MEMORY, THE POWER OF AI,' introducing various AI memory solutions including ▲HBM3E ▲DDR5 RDIMM ▲DDR5 MCRDIMM. HBM3E is a product with a capacity of 36GB (gigabytes) and a speed of 1.2TB (terabytes) per second, significantly enhancing AI computation speed and efficiency.
Additionally, SK Hynix unveiled the world's first DDR5 RDIMM based on the 10-nanometer 6th generation (1c) process, presenting a vision for next-generation data center memory solutions. This product is 11% faster than the previous generation and improves power efficiency by more than 9%, expected to reduce data center power costs by up to 30%.
SK Hynix also participated in the 'OIP Partner Technical Talk,' a side event of the OIP Forum. Byungdo Lee, a technical leader (TL) from SK Hynix's HBM package TE team, presented the results of the 'Joint Research on 2.5D Packaging for Improving HBM Quality and Reliability,' emphasizing technical cooperation with TSMC. The TL stated, "We will enhance the performance and efficiency of HBM4 by utilizing the TSMC Base Die," adding, "We will develop advanced MR-MUF and hybrid bonding-based HBM4 16-layer products to meet the market's high-density demands."
SK Hynix evaluated this event as "an opportunity to reaffirm technological superiority in the AI market and a solid partnership with the foundry." The company stated, "We plan to continue steady collaboration with OIP members and strengthen our strategic relationship through ongoing cooperation with TSMC."
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
