On the 11th, the Ministry of Trade, Industry and Energy announced that it signed a business agreement to strengthen the semiconductor advanced packaging industry ecosystem at EL Tower in Seoul, attended by Lee Seung-ryeol, Director of the Industrial Policy Office.
The business agreement was promoted to successfully advance the "Semiconductor Advanced Packaging Leading Technology Development Project," which is the first in the semiconductor post-processing field to pass the preliminary feasibility study. The ministry plans to invest 274.4 billion KRW from 2025 to 2031 for the semiconductor advanced packaging leading technology development project.
In the semiconductor industry, companies involved in semiconductor production, OSAT (Outsourced Semiconductor Assembly and Test), materials, parts, and equipment, and fabless (semiconductor design specialized companies) participated, including Samsung Electronics, SK Hynix, LG Chem, Hana Micron, and Hanmi Semiconductor. OSAT refers to semiconductor assembly, packaging, and testing processes.
The ministry explained, "Through this, OSAT and materials, parts, and equipment companies can receive performance evaluation, technical consultation, and test wafers necessary for advanced packaging technology development from chip manufacturing companies, enabling demand-driven technology development linked to client companies."
Advanced packaging has emerged as a core technology due to the need for single packaging of individual chips, driven by the limits of semiconductor process miniaturization and the increasing demand for high-performance, multifunctional, and low-power semiconductors following the advancement of artificial intelligence (AI) technology.
The ministry stated, "We are promoting R&D projects linked with overseas leading technology institutions to secure a technological competitive edge in the global semiconductor supply chain by preempting advanced packaging technology, which our companies are weak in. Through the project that passed the preliminary feasibility study, we plan to develop leading ultra-gap advanced packaging technologies, secure core technologies for materials, parts, and equipment and OSAT companies, and establish cooperative systems with overseas semiconductor specialized research institutions to preempt next-generation technologies."
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