Hanmi Semiconductor Launches 7th Generation New MicroSaw & Vision Placement at SEMICON Taiwan

Hanmi Semiconductor announced on the 4th that it will officially participate as a sponsor at the '2024 SEMICON Taiwan Exhibition' held in Taipei, Taiwan, showcasing the '7th Generation New Micro SAW & Vision Placement 6.0 Griffin' for the first time.

The 7th Generation New Micro SAW & Vision Placement is a core piece of equipment representing Hanmi Semiconductor, along with the TC Bonder for AI semiconductor HBM. After over seven years of research, its performance has been dramatically improved. It can reduce management costs and burdens associated with equipment operation.

Since the release of the 1st generation model in 1998, it has been supplied to leading semiconductor companies worldwide, earning significant trust, and is known as a world-best product boasting the No. 1 global market share for 20 consecutive years from 2004 to last year.

A Hanmi Semiconductor official explained, "The 7th Generation New Micro SAW & Vision Placement, a culmination of advanced technology with a total of 270 patents applied, has improved productivity and precision compared to previous models," adding, "we have newly added Blade Change Master, an unmanned automation technology for equipment, Auto Kit Change, and fully autonomous equipment setup."

Hanmi Semiconductor, the world market leader in AI semiconductor HBM TC Bonders, expects improved performance with the launch of the 7th Generation New Micro SAW & Vision Placement.

Hanmi Semiconductor has been actively delivering HBM TC Bonders ordered by customers since the third quarter. It is projected to achieve this year's sales target of 650 billion KRW. The company is also promoting the establishment of a factory with a total floor area of 10,000 pyeong. It anticipates that the 2026 sales target of 2 trillion KRW is achievable.