Doosan Corporation Participates in Korea's Largest Electronic Circuit Board Exhibition

Introduction to Various High-End CCLs

Doosan Corporation announced on the 3rd that it will participate in the 'International PCB and Semiconductor Packaging Industry Exhibition (KPCA Show 2024)' to be held on the 4th at Songdo Convensia in Incheon.

The KPCA Show is the largest domestic exhibition for printed circuit boards (PCB) and semiconductor packaging, hosted by the Korea PCB & Semiconductor Packaging Industry Association. It introduces advanced technologies to professionals in the PCB and semiconductor packaging industries and provides opportunities for technology transfer and various information. This year, over 140 companies including Doosan Corporation, Samsung Electro-Mechanics, LG Innotek, SEMTEK, and Daeduck Electronics are participating.

Doosan Corporation will showcase high-end copper clad laminates (CCL) that can be used for semiconductor packages, artificial intelligence (AI) servers, AI accelerators, and modules for autonomous driving in automobiles. CCL is a core material that serves as the raw material for PCBs used in almost all electronic devices.

At this exhibition, products will be presented under three themes: ▲Smart Devices (smartphones, smartwatches, autonomous driving modules for automobiles, etc.) ▲Semiconductor Substrates (memory, non-memory) ▲Communications (network boards, AI servers, AI accelerators, etc.).

For CCLs used in smart devices, flexible copper clad laminates (FCCL) will also be showcased, reflecting the increasing demand for curved forms of smart devices such as foldables. Doosan’s FCCL products have been recognized for their excellent quality, maintaining shape without deformation even after being folded and unfolded over 200,000 times, securing domestic and international foldable phone manufacturers as customers.

CCLs for semiconductor substrates are materials that electrically connect semiconductor chips and mainboards and protect semiconductors. They are high-rigidity products capable of withstanding the high temperatures of semiconductor processes.

CCLs for communications have low dielectric and low loss characteristics, reducing communication signal loss and enabling stable and fast processing of large volumes of data, making them applicable to data centers. As the AI market grows, Doosan has also launched CCLs for AI accelerators using communication CCLs.

A company representative said, "As innovative technologies such as information and communication technology (IT) and AI rapidly advance, the market for high-end CCLs, which are fundamental materials, is expected to grow further. As customer specifications increase across business areas, we plan to continue developing new materials and diversifying our product portfolio."