NVIDIA to Exceed 85% Market Share of HBM3E in 2025

NVIDIA's next-generation artificial intelligence (AI) dedicated chip, set to be released next year, is expected to drive the consumption share of the 5th generation high-bandwidth memory HBM3E (8-stack and 12-stack) to exceed 85%.

On the 8th, market research firm TrendForce stated, "Due to NVIDIA's H200 shipments, the consumption share of HBM3E is expected to rise above 60% this year," and added, "Next year, with the comprehensive adoption of HBM3E on the Blackwell platform, an increase in product layers, and the growth of single-chip HBM capacity, NVIDIA's HBM3E consumption will grow beyond 85%."

In particular, the market in the second half of this year is expected to focus on the HBM3E 12-stack products. While the mainstream of the HBM market consists of HBM3 and HBM3E 8-stack products, the demand for 12-stack products is gradually increasing as the latest AI chips require higher capacity and performance HBM.

Jensen Huang, CEO of NVIDIA, attending the Google Cloud event
(San Francisco=Yonhap News) Correspondent Kim Tae-jong = Jensen Huang, CEO of NVIDIA (right), is discussing the expansion of partnership with Thomas Kurian, CEO of Google Cloud, at the annual Google Cloud conference Next '23 held at Moscone Center in San Francisco on the 29th (local time). 2023.8.30
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According to TrendForce, NVIDIA's latest dedicated chip, the Blackwell Ultra, utilizes eight HBM3E 12-stack stacks, and the existing GB200 can also be upgraded alongside the soon-to-be-released B200A.

Accordingly, the proportion of 12-stack products in HBM3E is expected to increase to 40% next year, with the possibility of even higher growth.

Earlier, SK Hynix became the first memory company to start supplying the 5th generation HBM, HBM3E 8-stack products, to NVIDIA in March. The follow-up HBM3E 12-stack products have already been sample-supplied to major customers, and mass production began this quarter, with customer supply scheduled to start from the 4th quarter.

U.S. company Micron began mass production of HBM3E 8-stack in February and started sample supply of HBM3E 12-stack in May.

Samsung Electronics' HBM3E 8-stack and 12-stack products are currently undergoing NVIDIA quality testing. Samsung officially announced its future plans during the earnings conference call on the 31st of last month, stating that it will begin mass production and full-scale supply of HBM3E 8-stack products within the 3rd quarter and plans to supply 12-stack products in the second half of the year.