Hanmi Semiconductor to Begin Full-Scale TC Bonder Deliveries from Q3 This Year

Hanmi Semiconductor to Start Full-Scale Delivery of TC Bonders in Q3, Forecasting 650 Billion KRW in Sales This Year

Hanmi Semiconductor announced on the 26th that it recorded sales of 123.4 billion KRW and an operating profit of 55.4 billion KRW in the second quarter based on consolidated financial statements.

Hanmi Semiconductor will begin full-scale delivery of TC bonders for HBM, ordered from customers, starting in the third quarter of this year. It is expected to achieve its sales target of 650 billion KRW for this year.

Utilizing the site for a newly secured factory with a total floor area of 10,000 pyeong, the company plans to complete the expansion of the new factory by the end of next year. It is anticipated that the possibility of achieving the 2 trillion KRW sales target for 2026 will increase.

Hanmi Semiconductor Vice Chairman Kwak Dong-shin said, "With the explosive demand for artificial intelligence (AI) semiconductors, the HBM market is rapidly growing, and we expect an increase in orders for Hanmi Semiconductor’s world No.1 market share HBM dual TC bonders and HBM 6 SIDE inspection equipment." He added, "Strong sales of our existing core equipment, MicroSaw & Vision Placement, are also contributing to continuous performance growth."

Hanmi Semiconductor plans to launch the ‘2.5D Big Die TC Bonder’ in the second half of this year, the ‘Mild Hybrid Bonder’ in the second half of next year, and the ‘Hybrid Bonder’ in the second half of 2026.

Since establishing its Intellectual Property Department in 2002, Hanmi Semiconductor has focused on protecting and strengthening intellectual property rights with a team of about 10 specialists, filing over 120 patents including 111 related to HBM equipment. Its unique technology and durability are expected to secure a competitive edge and further enhance equipment competitiveness.