Meeting of SK Global Advisory Board with US AI, Semiconductor Companies and Experts
SK Global Forum Also Held in San Jose
Kwack No-jeong, CEO of SK Hynix, reviewed the status of the artificial intelligence (AI) semiconductor business, including high-bandwidth memory (HBM), and the packaging factory promotion in the United States.
According to the industry on the 16th, Kwack met with representatives from the U.S. academia and semiconductor industry at the 'SK Global Advisory Committee Meeting' held on the 12th (local time) in San Jose, California, to discuss future growth strategies and innovation plans.
From SK Hynix, President Kim Ju-seon (in charge of AI infrastructure), and Vice Presidents Ahn Hyun (N-S Committee), Kim Jong-hwan (DRAM development), Choi Woo-jin (P&T), Shin Sang-gyu (corporate culture), and Kim Ho-sik (memory system research) attended.
Semiconductor experts such as Richard Gottscho, Senior Vice President of Lam Research; Anthony Yen, Head of Technology Development Center and Vice President of ASML; Raja Koduri, CEO of MihiraAI; Steve Ganaem, President of Tata Electronics; Gary Surmeden, CEO of MEXT; and David Patterson, Professor at UC Berkeley, were also present.
SK Hynix focused on fostering sustainable cooperative partnerships with academia and startups for the growth of the memory ecosystem. In particular, collaboration plans with MihiraAI, founded by CEO Koduri who worked as a key designer for graphics cards at Intel and AMD, AI software development startup MEXT, and Tata Electronics were expected to be discussed. Additionally, SK Hynix reportedly exchanged opinions with Purdue University President Mung Chiang on advanced packaging investments and workforce development in West Lafayette, Indiana. Purdue University is located in West Lafayette, Indiana.
Earlier, SK Hynix announced plans to invest 5.2 trillion won to build an advanced packaging production base for AI memory in Indiana, USA, and to collaborate on semiconductor research and development with local research institutions such as Purdue University. The Indiana factory is scheduled to begin mass production of next-generation HBM and other AI memory products in the second half of 2028.
Furthermore, SK Hynix held the '2024 SK Global Forum' together with SK Innovation and SK Telecom in San Jose from the 12th to the 14th. At the forum, CEO Kwack delivered a keynote speech.
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