[Click eStock] "Hanmi Semiconductor, Mobile HBM Market Also Blossoming"

Hyundai Motor Securities forecasted that Hanmi Semiconductor will benefit from the increasing demand for GPUs and mobile HBM within on-device environments. The target stock price was raised to 300,000 KRW.

Minjung Kwak, a researcher at Hyundai Motor Securities, explained, "Recently, in the AI semiconductor market, the emphasis has been on reducing the physical distance between AI computing units and memory, and expanding bandwidth to enable rapid data exchange." She added, "The market is expanding from servers to on-device, and just as GPUs in AI servers perform AI computations by exchanging data with HBM, on-device systems also require memory equivalent to HBM."

She analyzed, "The existing method where GPUs operate inside CPUs results in slower processing speeds and issues during transmission to servers," and stated, "To resolve these problems, CPUs and GPUs inside chips are being separated, and HBM (or LLW) is being applied."

Researcher Kwak said, "As a result, there is an increase in demand for GPUs and mobile HBM within on-device environments," adding, "With the market blossoming from traditional data center servers (B2B) to mobile HBM (B2C), Hanmi Semiconductor's core products such as dual TC bonders, mild hybrid bonders, hybrid bonders, and even 2.5D big die bonders are highly likely to be adopted." She emphasized, "As a major supplier of mobile HBM, the roles of SK Hynix and Micron are expected to expand significantly."