SK Hynix Also Launches Recruitment of 'Semiconductor Talent'... Large-Scale Hiring of New Graduates and Experienced Professionals

Unprecedented July Job Postings... Triple-Digit Scale
All Fields Including Cheongju M15X and Pinpet
New Hires Expected in September, Experienced in November
Samsung Electronics DS Also Hiring Experienced by 9th

SK Hynix is unusually recruiting semiconductor talent in July. This is interpreted as a decision to maintain leadership in the high-bandwidth memory (HBM) market and secure technological competitiveness.

According to industry sources on the 4th, SK Hynix announced a large-scale recruitment posting simultaneously for new graduates and experienced hires. The total recruitment scale is in the triple digits.

Considering that companies usually conduct recruitment for new graduates in April for the first half of the year and in September for the second half, it is unusual to recruit both new graduates and experienced workers simultaneously in July. SK Hynix used to conduct new graduate recruitment in the first and second halves of the year but switched to continuous recruitment starting in 2021.

This time, SK Hynix is recruiting massively across all areas for future growth, including AI memory semiconductor fields such as HBM design and advanced packaging, engineers for the newly announced Cheongju M15X investment, and the U.S. advanced packaging production base preparation. In particular, to strengthen capabilities in logic element technology, which is becoming increasingly important in memory semiconductor technology, they are also hiring experienced employees in the FinFET field.

New employees who pass the document screening will go through the written test, SKCT (SK Competency Test), and interviews, and are expected to start working at the end of September. Experienced hires are expected to start working in November.

Following this recruitment, SK Hynix plans to conduct a 'Junior Talent' screening in September targeting employees with 2 to 4 years of experience. Recruitment for new graduates, including those graduating in February next year and those already graduated, is also planned.

Since SK Hynix has set a plan to invest 103 trillion won by 2028 in preparation for the increase in AI memory demand, the scale of excellent talent recruitment is also expected to continue expanding. Earlier in April, they recruited experienced employees for 14 positions including HBM circuit design and product development. At the end of last year, they posted recruitment announcements for experienced employees in 28 positions including DRAM design and HBM package product development.

As the artificial intelligence (AI) memory semiconductor market is explosively growing, Samsung Electronics is also actively securing talent to recover its super-gap competitiveness.

Recently, Samsung Electronics' Device Solutions (DS) division, responsible for semiconductor business, announced that it is recruiting experienced employees until the 9th. The recruitment positions number about 800, including next-generation DRAM solution product controller development and verification such as HBM, and Compute Express Link (CXL) product development.

This is the first recruitment under the leadership of Vice Chairman Jeon Young-hyun, who took charge of the DS division in May. The DS division also conducted large-scale experienced recruitment in February.