Hanmi Semiconductor Launches 'HBM 6-Side Inspection Equipment'

Hanmi Semiconductor CEO Dongshin Kwak and the HBM inspection equipment 'HBM 6 SIDE INSPECTION model' being introduced for the first time. / Photo by Hanmi Semiconductor

Hanmi Semiconductor announced on the 15th that it has launched the ‘HBM 6 SIDE INSPECTION,’ an essential process equipment for AI semiconductor HBM (High Bandwidth Memory).

Hanmi Semiconductor Vice Chairman Kwak Dong-shin stated, “The newly introduced ‘HBM 6 SIDE INSPECTION’ is equipment that minimizes defect rates through vision inspection of all six sides of semiconductor chips (Dies) stacked using the TSV process.” He added, “It features significantly improved productivity and inspection precision to enhance HBM yield, and together with Hanmi Semiconductor’s Dual TC Bonder, which vertically stacks semiconductor DRAM chips, it is expected to become a key piece of equipment that will greatly contribute to future sales.”

Since establishing its Intellectual Property Department in 2002, Hanmi Semiconductor has focused on protecting and strengthening intellectual property rights through a dedicated team of about 10 specialists. To date, the company has filed over 120 patents, including 111 related to HBM equipment, securing a dominant position with unique technology and durability, which is expected to further enhance the competitiveness of its equipment.

From the second half of last year until now, Hanmi Semiconductor has recorded orders exceeding 200 billion KRW from SK Hynix for the essential HBM process equipment, the ‘Dual TC Bonder Griffin.’ Recently, it also received an order worth 22.6 billion KRW from the US-based Micron for the ‘Dual TC Bonder Tiger.’ Through this, Hanmi Semiconductor has supplied both of the other two global Top 3 memory semiconductor manufacturers, excluding Samsung Electronics, reaffirming its position as a leading company in the AI semiconductor core HBM production equipment industry.