Hanmi Semiconductor Signs TC Bonder Contract for HBM with US Micron... 'Only Samsung Left'

Hanmi Semiconductor announced that it has secured a supply contract worth 22.6 billion KRW from the U.S. memory semiconductor company Micron Technology for the production of AI semiconductor high-bandwidth memory (HBM) using the ‘Dual TC Bonder Griffin’.

According to recent market research firm TrendForce, the current HBM market is focused on the 5th generation product HBM3E, and there is a severe supply shortage compared to AI market demand.

The latest solutions from NVIDIA, a global leader in AI semiconductors, the GB200 and B200 models, are expected to be equipped with HBM3E. Currently, HBM3E can be produced by SK Hynix, Micron Technology, and Samsung Electronics. SK Hynix utilizes Hanmi Semiconductor’s TC Bonder, achieving significantly higher HBM technology competitiveness and yield compared to competitors, leading the HBM market share.

With Hanmi Semiconductor signing the TC Bonder supply contract with Micron Technology, Hanmi Semiconductor’s Dual TC Bonder for HBM3E production, a core component of AI semiconductors, is now used by all of the global top 3 memory semiconductor makers except Samsung Electronics.

TrendForce expects the HBM market size to grow from $2.04186 billion (approximately 2.76 trillion KRW) in 2023 to $6.3215 billion (approximately 8.55 trillion KRW) in 2028, as global big tech companies such as Microsoft, Google, AWS, and Meta, in addition to NVIDIA and AMD, are developing their own AI semiconductors.

Since establishing its Intellectual Property Department in 2002, Hanmi Semiconductor has focused on protecting and strengthening intellectual property rights through a dedicated team of about 10 specialists. To date, it has filed over 120 HBM equipment intellectual property rights, including a total of 111 patents. Based on this, it is expected to secure a competitive edge with outstanding technology and durability, further enhancing the competitiveness of its equipment.