FNS Tech is showing strong performance. As the stock prices of glass substrate-related companies such as YC Chem and Chemtronics surge, buying interest appears to be spreading to FNS Tech, which is developing glass substrate-related technology.
As of 10:47 AM on the 4th, FNS Tech was trading at 13,220 KRW, up 940 KRW (7.65%) compared to the previous trading day.
According to industry sources, FNS Tech is currently advancing the etching process for glass core substrates used in semiconductor packages, which has recently become a focus in the industry. Specialized media reported that FNS Tech is believed to be targeting entry into the supply chain of Absolix, a subsidiary of SKC. When manufacturing glass core substrates, holes are processed with lasers and then etched; FNS Tech is known to be conducting research and development aimed at this etching process.
If FNS Tech secures the expected etching technology, it is anticipated to supply related equipment and parts to Absolix's glass core substrate factory currently being built in Georgia, USA. The Absolix Georgia plant is nearing completion.
Although no company worldwide is mass-producing glass core substrates yet, industry interest in glass core substrates is growing, with semiconductor company Intel announcing plans to apply mass production of glass core substrates before 2030. Glass core substrates are expected to be used for large-area artificial intelligence (AI) server substrates, which are difficult to handle with existing resin substrates.
Samsung Group's electronics affiliates are pooling efforts for research and development to commercialize glass substrates, known as the "dream substrate," at an early stage. KB Securities researcher Changmin Lee analyzed, "Samsung Electro-Mechanics is expected to be responsible for research, development, and mass production of glass substrates, Samsung Electronics will handle the integration of semiconductors and substrates, and Samsung Display will take charge of glass process-related roles."
The researcher added, "Glass substrates, which were previously classified as over-spec, have recently gained attention due to the rapid expansion of artificial intelligence (AI)," and "It is expected that AI's data processing volume will increase exponentially in the future." Furthermore, he explained, "Given the current trend, by 2030, organic material substrates are expected to struggle to handle the expansion of transistor counts through 2.5-dimensional (D) and 3D packaging."
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