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Hanmi Semiconductor Launches 'Dual TC Bonder Tiger'... Essential Equipment for HBM Process

Hanmi Semiconductor launched the ‘Dual TC Bonder Tiger,’ an essential process equipment for high-bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors, on the 1st.


Hanmi Semiconductor Vice Chairman Kwak Dong-shin introduced, "The Dual TC Bonder Tiger is a model equipped with the latest technology tailored to global semiconductor customer specifications. It is bonding equipment that stacks semiconductor chips manufactured using the TSV process onto wafers."


He continued, "Currently, the Dual TC Bonders for HBM production, which is the core of AI semiconductors, are being sold according to customer needs and specifications with the hyper model Griffin and the premium model Dragon. With the addition of the extra model Tiger, sales are expected to increase this year," he explained.


Since establishing the Intellectual Property Department in 2002, Hanmi Semiconductor has focused on protecting and strengthening intellectual property rights through a dedicated team of about 10 specialists. To date, they have filed over 110 patents related to HBM equipment. Their outstanding technology and durability are expected to secure a competitive edge and further enhance the competitiveness of their equipment.


According to a recent report by Hyundai Motor Securities, demand in the U.S. for Hanmi Semiconductor’s Dual TC Bonder for HBM production, a core AI semiconductor component, is expected to increase.


Hyundai Motor Securities researcher Kwak Min-jung raised Hanmi Semiconductor’s target stock price from 130,000 KRW to 200,000 KRW. She analyzed, "Along with the increasing demand for TC Bonder equipment for HBM, demand for inspection equipment is also expected to continue rising." She emphasized, "According to the U.S. Department of Commerce, a roadmap for 55-layer HBM has been presented through 2035, and a supply chain within the U.S. will be established over five years. The ‘On Shoring strategy’ based on the TSMC-SK Hynix-NVIDIA alliance will act as a major growth driver for Hanmi Semiconductor."


Hanmi Semiconductor Launches 'Dual TC Bonder Tiger'... Essential Equipment for HBM Process


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