"HBM, the Most Technology-Intensive DRAM"
"Going forward, High Bandwidth Memory (HBM) will be specialized and customized into products that embody the value customers desire."
On the 28th, Kwon Eon-oh, Vice President of SK Hynix, stated this in an interview with the company newsroom. He is in charge of completing the SK Hynix HBM technology roadmap and said, "The changes brought about by Artificial Intelligence (AI) are greater and more intense than ever before," adding, "I will enhance HBM technology with pride and responsibility."
SK Hynix established an 'AI Infrastructure (Infra)' organization to strengthen business competitiveness in the AI era through organizational restructuring and executive appointments at the end of last year. Vice President Kwon was appointed as the new executive in charge of HBM PI under this organization.
In 2022, while serving as a DRAM development research fellow, Vice President Kwon led the upgrade of the latest LPDDR DRAM performance by introducing the next-generation process 'High-K Metal Gate (HKMG)' to mobile DRAM, the world's first low-power double data rate (LPDDR) DRAM.
Vice President Kwon evaluated, "HBM is a product of difficult and complex advanced technology," and said, "It can be called the most technology-intensive DRAM." He explained that the appeal of HBM, which triggered the convergence of system semiconductors and memory semiconductors, is significant, and that he is dedicated to technological innovation.
Vice President Kwon said, "Entering the AI era, rapid changes at an unprecedented level are continuing," adding, "It is more important than ever to predict changes and respond flexibly." He continued, "To lead the AI era and maintain top technology, we are focusing on innovation in elemental technologies and rapid productization through technology development," and explained, "We are actively communicating and collaborating with customers and external partners."
He also predicted, "In the future, AI memory will expand beyond current data center use to forms such as application-specific integrated circuits (ASICs) that enhance performance and efficiency for specific purposes, or on-device forms optimized for customer products (methods of running AI on devices)," adding, "I believe not only HBM but various types of DRAM will be used as AI memory."
Vice President Kwon expressed his ambition, saying, "I have been entrusted with an important role at a time when everyone's expectations for SK Hynix HBM products are high," and added, "Based on the experience and challenging spirit of our members who developed the world's best HBM, I will do my best to achieve next-generation technological innovation."
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