[Featured Stock] Nepes Highlights '3C' Including CXL and Chiplet... Chiplet Heterogeneous Integration AI Semiconductor National Project Gains Attention

Nepes is showing strong performance. The so-called '3C'?chiplet, Compute Express Link (CXL), and customized chip?are being recognized as key technologies and services that will determine the semiconductor industry's dominance this year, which appears to be influencing the stock price. As attention focuses on the semiconductor sector, Nepes, which possesses related technologies, is also gaining attention.

As of 10:41 AM, Nepes was trading at 21,300 KRW, up 1,630 KRW (8.29%) from the previous trading day.

According to industry sources, with the spread of artificial intelligence (AI) technology, the importance of technologies that enhance semiconductor data processing performance (CXL) and technologies that enable the production of high-performance AI semiconductors at lower costs (chiplet) is increasing. The technology to supply AI chips customized for client companies is also evaluated as a core competitive advantage.

Fabless semiconductor design specialist AMD developed a new AI accelerator product, the ‘MI300X,’ in early December last year using chiplet technology. Chiplet is a technology that produces graphics processing units (GPU), central processing units (CPU), input/output (I/O) terminals, etc., in separate processes and then combines them.

The chiplet market size is expected to grow from $6.5 billion (approximately 8.4 trillion KRW) in 2022 to $148 billion (approximately 192 trillion KRW) by 2028.

To standardize the international chiplet structure, Samsung Electronics, TSMC, Intel, AMD, ARM, and others have launched the UCIe (Universal Chiplet Interconnect Express) consortium, with Nepes participating as a technical workgroup member among domestic back-end process companies.

Nepes is undertaking national projects such as the ‘Development of Chiplet Heterogeneous Integration Ultra-High-Performance AI Semiconductor’ with a total project cost of 44 billion KRW led by the Ministry of Science and ICT, aimed at developing core packaging technologies for system AI semiconductors. Additionally, it is working to secure foundational AI semiconductor technologies specialized for on-device applications.