Yesty Secures Additional HBM Equipment Order... "Large-Scale Orders Expected to Continue"

Yesty, a semiconductor equipment specialist company, announced on the 5th that it has signed an additional supply contract worth 7.5 billion KRW for core equipment of high-bandwidth memory (HBM) with a global semiconductor company. With this, the cumulative order amount for HBM equipment this year reaches 32.2 billion KRW, marking the largest scale in semiconductor equipment history. Due to the aggressive investment by the client company, a large-scale additional order is expected within the next 1 to 2 months.

Yesty has also succeeded in diversifying the supply items of HBM equipment. The equipment supplied by Yesty includes 'wafer pressing equipment' and 'EDS chiller.' These are applied respectively in the 'underfill' and 'EDS (Electrical Die Sorting)' processes during HBM manufacturing. The underfill process is a key step to uniformly cure insulating materials to optimize HBM performance. EDS is an essential process that enhances the reliability of semiconductor chips through testing.

Yesty is currently negotiating with clients to supply not only wafer pressing equipment and EDS chillers but also 'package pressing equipment' necessary for HBM manufacturing. Through continuous research and development, Yesty plans to expand orders by enhancing the performance of existing HBM equipment as well as developing new equipment.

A Yesty representative stated, “As the AI market rapidly expands, the HBM market is also growing quickly. Global semiconductor companies are fiercely competing to dominate the HBM market through trillion-won scale investments, so orders for HBM equipment are expected to continue expanding.”

He added, “Based on our proprietary high-temperature and high-pressure control technology, we have accumulated technical know-how through national projects related to pressing equipment,” emphasizing, “We have also filed several patents related to pressing equipment, establishing entry barriers, so there are no competitors in the domestic HBM pressing equipment sector.”

Global semiconductor companies are also accelerating the commercialization of next-generation HBM. SK Hynix succeeded in developing the world’s first and highest-spec 5th generation ‘HBM3E.’ Last month, Samsung Electronics also unveiled HBM3E. As global companies competitively develop high-performance HBM, demand is expected to steadily increase not only for upgrades of existing HBM equipment but also for new equipment.