LaserCell is showing strong performance. The news that it has developed the ‘300mm large-area surface laser core optical system (BSOM) technology’ applicable to artificial intelligence (AI) semiconductor processes and microLED display processes appears to be influencing its stock price.
As of 9:15 AM on the 5th, LaserCell is trading at 15,130 KRW, up 13.33% from the previous day.
AI semiconductors are composed in a package form of high-performance chiplet logic semiconductors (Chiplet CPU/GPU) and wide-band ultra-high-speed memory (HBM). To realize this, flip-chip ball grid array (FCBGA) technology, a heterogeneous chip interconnection technology, is required. However, applying this technology may cause bending issues in AI semiconductors.
The 300mm large-area variable and fixed surface laser technology mass-produced by LaserCell is optimized for performing large-area bonding processes essential in AI semiconductor and microLED display manufacturing processes, and is evaluated to significantly improve production yield. In the case of the large-area laser beam BSOM system, it is easy to complete laser beam sizes of 300mm or more in width and length, and through a surface (Area) type light source rather than a typical spot type, it has succeeded in homogenizing the laser irradiation surface to a level exceeding 90%. The 300mm width and length correspond to 12 inches based on semiconductor wafers.
LaserCell has made it easier to produce surface lasers over 300mm at the required energy density by combining the purely domestic BSOM technology with high-power laser NBOL technology. The implementation of the advanced pressure-type surface laser equipment ‘LC Bonder’ and the non-pressure surface laser equipment ‘LSR’ laser reflow system, which apply surface lasers over 300mm, is expected to play a key role in leveling up Korea’s materials, parts, and equipment technologies in the next-generation laser optical technology field, advanced AI semiconductor industry, and next-generation display industry.
Kim Namseong, CTO leading the R&D headquarters, said, "The 300mm-based surface laser technology, developed for the first time domestically, can solve various issues demanded by the market and achieve differentiated high productivity." He added, "We are currently collaborating with various semiconductor companies and packaging specialists based on the synergy between large-area laser core technology that can resolve the recent AI semiconductor shortage, high-power laser systems, and process application technologies."
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