LaserCell is showing strength. The stock price is interpreted to be influenced by the plan to become a global company following the relocation of its headquarters from Asan, Chungnam to Dongtan Industrial Complex in Hwaseong-si, Gyeonggi-do. With the expansion of the artificial intelligence (AI) and high-performance computing (HPC) markets, high-bandwidth memory (HBM) has emerged as the next growth driver in the DRAM market. Demand for laser technology, which can solve bonding issues in AI semiconductors, is expected to increase.
As of 9:52 a.m. on the 24th, LaserCell is trading at 15,340 KRW, up 15.25% compared to the previous trading day.
LaserCell manufactures equipment using the world's first recognized "surface light source-area laser" technology, which corresponds to the bonding process during packaging.
CEO An Geon-jun of LaserCell recently stated in an interview with a media outlet, "Currently, global companies have increased demand for laser technology that can solve bonding issues in AI semiconductors." He added, "There is a growing sentiment that laser bonding technology is an alternative to overcome the warping of the entire packaging."
According to related industries, not only Samsung Electronics and SK Hynix but also global semiconductor companies are struggling to expand their post-processing lines that determine HBM competitiveness.
CEO An introduced, "Among LaserCell's equipment, there is laser compression bonding (LCB) equipment," adding, "It is necessary for HBM." He further explained, "It has a patent in this field for adding a pressing function to LSR, which bonds semiconductors by irradiating laser over a surface rather than a point."
He emphasized, "Proposals have been made or joint tests are being conducted with major companies, including global firms that recently declared re-entry into the semiconductor foundry market and those that have previously supplied equipment."
CEO An said, "We expect a significant growth phase soon after surpassing the golden cross (the point where benefits exceed costs)."
Researcher Lee Jong-wook of Samsung Securities explained, "There is a possibility that adoption of new technologies in the semiconductor industry will increase," adding, "While there are limitations in technological differentiation in the front-end process, the back-end process is emerging as a 'land of opportunity' to overcome technological limits." He continued, "Leading companies such as TSMC, Intel, and Samsung Electronics are increasing investments in advanced packaging like 2.5D and 3D, which stems from these technological changes."
Researcher Lee also analyzed, "Since LaserCell's surface light source technology has potential utility, if its technological effectiveness can be proven through mass production sales, market perception could sufficiently change." He added, "An encouraging aspect is that LaserCell is currently conducting 44 projects," and explained, "It is understood that results from these projects are gradually emerging starting from the second quarter of this year."
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