SK Hynix Hosts 'IEEE EDTM'
Vice President Cha Sun-yong Introduces Future Memory Technologies
"We are exploring both approaches: scaling down 2D and moving to 3D. We are examining whether 3D technology can definitively replace current technology, but it is still in the early stages."
Cha Seonyong, Vice President and Head of SK Hynix Future Technology Research Institute, said this on the 8th at the 'IEEE EDTM' held at COEX in Samseong-dong, Seoul. His remarks were related to the potential replacement of 3D DRAM technology, which is gaining attention as existing 2D DRAM miniaturization technology reaches its limits.
Chaseon-yong, Vice President in charge of SK Hynix Future Technology Research Institute, is delivering a keynote speech at IEEE EDTM. / Vice President Cha delivered a keynote speech titled "The Journey of Memory Innovation in the AI Computing Era." He explained that as AI technology advances and the amount of data to be processed explodes, the need for innovation in memory technology has also increased.
He identified ▲Continuity ▲Convergence ▲Changes as key keywords driving future semiconductor industry changes. He explained that existing memory technology will continue to develop while new attempts at technology convergence will proceed simultaneously. Changes in the industrial environment due to environmental, social, and governance (ESG) demands are also noteworthy factors.
Among the future memory technologies introduced by Vice President Cha are ▲3D DRAM ▲Processor-in-Memory (PIM) ▲Accelerator-in-Memory (AiM). Unlike the conventional method of creating cells on a plane (2D), 3D DRAM is a next-generation technology that stacks DRAM layers vertically. It is gaining attention as the limitations of the current method, which reduces circuit linewidth to increase integration density, become more apparent.
PIM is a next-generation product that performs computation functions within memory, and one type of PIM introduced by SK Hynix is AiM. SK Hynix developed a GDDR6-AiM sample based on graphics DRAM in February last year. Vice President Cha explained, "AiM is 16 times faster in computation speed compared to general DRAM."
Chaseonyong, Vice President in charge of SK Hynix Future Technology Research Institute, is introducing future memory technology. / Vice President Cha predicted that with continued technological advancements, products such as ▲SOM ▲STT-MRAM ▲ACiM could also be developed in the future. He said, "ACiM is a future product that eliminates the boundary between computing and memory," adding, "We will be able to see it in the future."
IEEE EDTM is an international academic conference presented by IEEE EDS, an international organization and society in the fields of electrical, electronic, and computer engineering. It discusses the overall direction of the industry, including semiconductor manufacturing technology and equipment innovation. Since starting in Japan in 2017, it has been held in Singapore, Malaysia, and other locations. This year, it was held for the seventh time in Korea, co-hosted by SK Hynix and the Nano Technology Research Council.
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