Up to 10x Improvement in Advanced Semiconductor Package Efficiency
Applied to Next-Generation Displays and Electric Vehicle Secondary Batteries
Product Supply to World's Largest Foundry Semiconductor Company
[Asia Economy Reporter Jang Hyowon] The area laser technology developed by LaserCell, a specialized laser platform company, is considered a groundbreaking technological development in the advanced semiconductor field. Unlike the mass reflow bonding method, which uses heat and has been employed in the electronics industry for decades, LaserCell pioneered a world-leading bonding method that expands the laser beam to the size of a laptop PC. This technology has been adopted by global companies in advanced semiconductors, next-generation displays, electric vehicles, and secondary batteries, achieving actual commercialization.
The advantage of this method lies in solving the issues of bending in heterogeneous semiconductor packages and yield productivity limitations, which were constraints in existing technologies. In numerical terms, it improves efficiency by up to 10 times compared to conventional methods. By securing clear technological differentiation from global competitors through its core technologies, the optic system (BSOM) and laser system (NBOL), and possessing the largest product lineup worldwide, LaserCell takes pride in being a ‘paradigm changer’ in the area light source laser field. Currently, it holds about 150 domestic and international patent IPs in related fields.
Recognized for its excellence as a ‘paradigm changer’ that transformed conventional technology methods, LaserCell successfully listed on KOSDAQ in June through a technology-special listing. Despite the global economic crisis, it recorded an exceptionally high public offering competition rate of 1845 to 1, reflecting the market’s recognition of LaserCell’s differentiated technological value and future potential.
Heterogeneous advanced semiconductor technology refers to the latest semiconductor packaging technology that mounts the central processing unit (CPU), graphics processing unit (GPU), and high-bandwidth memory (HBM) in a single package to maximize performance. Since multiple components are mounted in one package, the package size inevitably becomes large and thin, causing defects due to bending during the manufacturing process. The ‘area light source laser technology’ bonds only the required area within seconds, preventing such bending phenomena. Due to this advantage, LaserCell explains that its advanced area laser platform is an optimized technology for large-area packages of heterogeneous semiconductors.
LaserCell provides various ‘LSR series’ products applying the ‘area light source laser’ technology to globally renowned semiconductor foundry companies, mobile device manufacturers, and electric vehicle secondary battery manufacturers. It is evaluated that this technology has already been recognized by several global major companies across various business sectors. Currently, numerous projects with many domestic and international global clients are ongoing, and with LaserCell’s growth, the area laser-related market is expected to expand further.
In the mini/micro LED display process, which has been spotlighted since last year, LaserCell’s area laser was the first in the industry to be adopted, receiving high praise. In this regard, LaserCell is conducting multiple projects with various domestic and international clients.
Kim Namseong, CTO overseeing LaserCell’s research institute, stated, “We are focusing the company’s development and mass production capabilities on projects with the world’s largest foundry semiconductor company,” adding, “The applicability is very high in next-generation display fields and electric vehicle secondary battery processes, so we will expand related business sectors and do our best to grow the market.”
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