Exhibition of Global No.1 Products such as Wireless Frequency Package Substrates and Chip-on-Film
Jeong Cheol-dong, CEO of LG Innotek / Source=LG Innotek
[Asia Economy Reporter Kim Pyeonghwa] LG Innotek will participate in the 'International PCB and Semiconductor Packaging Industry Exhibition (KPCA Show 2022)' held from the 21st to the 23rd at Songdo Convensia in Incheon Metropolitan City, showcasing new substrate material products.
KPCA Show 2022 is an international PCB and semiconductor packaging specialized exhibition hosted by the Korea PCB and Semiconductor Packaging Industry Association (KPCA). More than 180 domestic and international companies participate to share the latest technology trends. At the opening ceremony on the first day, Jung Cheol-dong, president of LG Innotek and chairman of KPCA, will deliver the opening address.
At this exhibition, LG Innotek will unveil innovative products in three areas: ▲Flip Chip Ball Grid Array (FC-BGA) substrates ▲Package substrates ▲Tape substrates.
In the FC-BGA substrate zone, LG Innotek will reveal for the first time the FC-BGA new product scheduled for mass production next year. FC-BGA substrates are semiconductor substrates that connect semiconductor chips to the main substrate. They are mainly used in central processing units (CPUs), graphics processing units (GPUs), and communication chipsets for PCs, servers, and more.
LG Innotek applied various digital transformation (DX) technologies such as AI and digital twin to the FC-BGA development process to minimize the critical warpage phenomenon (the bending of substrates caused by heat and pressure during manufacturing) that affects product performance. The warpage phenomenon is occurring proportionally to the increasing area of FC-BGA substrates due to the high performance and high specifications of PCs and servers.
LG Innotek's FC-BGA substrates are characterized by their ability to be manufactured in various thicknesses according to customer needs, including coreless (removal of the core layer in semiconductor substrates), thin core, and thick core substrates. The coreless technology, first applied in the industry to substrates for radio frequency system-in-package (RF-SiP), was effectively applied to FC-BGA substrates.
In the package substrate zone, LG Innotek will showcase semiconductor substrates used in the latest mobile wireless communication front-end modules, application processors (AP), and memory. Exhibits include RF-SiP substrates, which hold the world's number one market share, as well as substrates for flip chip chip-scale packages (FCCSP) and chip-scale packages (CSP).
RF-SiP substrates used in communication semiconductors apply ultra-precision and high-integration technologies such as fine circuits and coreless structures, along with new materials, reducing thickness and signal loss compared to existing products. Using this product allows for more efficient internal smartphone design and maximizes the transmission efficiency of 5G communication signals.
In the tape substrate zone, LG Innotek will present chip-on-film (COF), which holds the world's number one market share, 2-metal chip-on-film (2Metal COF), and chip-on-board (COB). Chip-on-film and 2-metal chip-on-film connect display panels and main substrates in smartphones, TVs, etc., while chip-on-board is used in credit cards, passports, and more.
Chip-on-film applies LG Innotek's ultra-fine process technology. This product is suitable for high-resolution and thin bezel displays, and demand is increasing not only for LCDs but also for OLEDs.
Son Gil-dong, Executive Vice President and Head of Substrate Material Business Division at LG Innotek, said, “Based on our global market-leading capabilities, we will rapidly expand the substrate material business from mobile and display to PC/server, communication/network, metaverse, and automotive sectors. We will continue to introduce new substrate material products to innovate customer experiences.”
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