[Asia Economy Reporter Hyungsoo Park] NeonTech, a domestic semiconductor equipment company, is showing strong performance. The news that it developed the world's first double-sided cleaning Saw & Sorter for flip-chip ball grid array (FC-BGA) appears to have influenced its stock price. It is expected to significantly improve the efficiency of semiconductor post-processing and strengthen global competitiveness in the semiconductor package sector.
As of 2:32 PM on the 21st, NeonTech is trading at 4,825 KRW, up 7.58% from the previous day.
NeonTech announced that it has developed the 'Double-sided Cleaning Saw & Sorter (TB Cleaning Saw & Sorter)' equipment for FC-BGA semiconductor packages, equipped with double-sided cleaning and drying functions. Due to the ultra-high integration of semiconductor devices, the number of processes has increased, and many residues or contaminants remain on the surface after each process, increasing the importance of the cleaning process. NeonTech has focused on research and development (R&D) of the cleaning process for over a year, successfully maximizing cleaning capability while simplifying the process steps.
Younghan Bae, Executive Director of NeonTech, said, "The Double-sided Cleaning Saw & Sorter cleans immediately after cutting the semiconductor package, so it does not transfer to a washing tray. It rotates the JEDEC tray 180 degrees to simultaneously perform upper and lower cleaning and drying, then conducts a final inspection before immediate discharge."
The 'Double-sided Cleaning Saw & Sorter' drastically reduces the size of inline Saw & Sorter and cleaning equipment, securing about 60% additional space. Since a washing tray is not required, it reduces the cost of purchasing auxiliary materials, and eliminates simple repetitive tasks involved in the cleaning process, thereby lowering labor costs.
Sungil Hwang, CEO of NeonTech, stated, "Since the Double-sided Cleaning Saw & Sorter simplifies the cleaning process while maximizing cleaning power, FC-BGA manufacturers will be able to produce semiconductor packages with excellent performance and quality." He added, "With reduced equipment size and significantly faster process speed, it will open a supply path in the FC-BGA semiconductor package market, where supply shortages are currently ongoing."
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