[Chip Talk] "Seeking Talent from Samsung and SK"... Why Qualcomm Is Expanding DRAM Design in Korea

Recruitment for 'Memory-Centric' Computing Design Talent
Targeting On-Device AI for PCs and Automobiles
"Recognition of Korea's Capabilities, Fabless Talent War Begins"

Qualcomm's job posting for '3D DRAM' design personnel. Screenshot from Qualcomm website

Qualcomm, a global leader in semiconductor design, has begun recruiting talent in Korea for the design of next-generation memory semiconductors, specifically three-dimensional (3D) DRAM. This move is being interpreted as a proactive strategy to resolve memory bottlenecks in preparation for the era of on-device artificial intelligence (AI). Experts predict that, following Qualcomm's lead, other global fabless (semiconductor design) companies are also likely to seek out memory specialists in Korea.

According to the semiconductor industry on March 2, Qualcomm Korea has recently posted job openings for experienced application-specific integrated circuit (ASIC) engineers, including 3D DRAM architects. Qualcomm stated that it is looking for design personnel who will be responsible for evaluating and optimizing 3D DRAM structures and will participate in implementing "memory-centric" computing for data centers, mobile devices, computing, and extended reality (XR) applications. This indicates not only a focus on product development, but also an intention to make memory the central element of future system design.

3D DRAM is a next-generation product in which memory cells, typically arranged in a planar fashion, are stacked vertically. This structure significantly increases capacity compared to traditional designs and, by reducing the physical distance between the processor and memory, shortens data transfer times. Given that data transfer speed, rather than computational power itself, is the key performance factor in AI processing, the 3D structure is seen as a solution to overcoming structural limitations.

In particular, Qualcomm emphasized experience in 2.5D and 3D packaging in this recruitment. This suggests an approach that goes beyond using 3D DRAM as a standalone memory chip, considering processor-adjacent placement or stacking. In other words, the company is aiming to physically integrate the chip and memory to reduce bottlenecks at the system level. This strategy aligns with the industry trend where packaging technology determines competitiveness in both high-performance computing and mobile devices.

Experts interpret this recruitment as a preemptive move to prepare for the expansion of on-device AI. On-device AI refers to processing AI computations directly on devices such as smartphones, PCs, and automobiles, rather than relying on cloud servers. Unlike AI chips for data centers, the main variables here are power efficiency and area constraints.

Kim Yongseok, Professor of Electrical and Computer Engineering at Sungkyunkwan University, explained, "Qualcomm is focusing on the on-device AI field and appears to be preparing to solve memory bottlenecks as AI performance increases in the future. HBM for mobile will be key, and it is highly likely to be applied to AI semiconductors for PCs and automobiles." He added, "This should be seen as a move to prepare for the shift in AI workloads from training to inference." This suggests that memory architecture is now entering a redesign phase in line with changes in the AI computing paradigm.

Another important point is the recruitment location. Qualcomm's search for 3D DRAM experts in Korea is seen as recognizing the competitiveness of domestic memory technology talent. Samsung Electronics and SK hynix together hold over 70% of the global DRAM market share. Since these companies also lead the development of next-generation memory technologies, personnel with experience at these firms can be strategic assets for global fabless companies. Lee Jonghwan, Professor of System Semiconductor Engineering at Sangmyung University, stated, "Korea is overwhelmingly ahead in memory, and if an engineer with such local experience handles the design, it is the best choice for Qualcomm." This reflects the trend of Korea's memory talent pool expanding into the design ecosystem.

The industry is also paying attention to the possibility that this recruitment drive will not be a one-off event. As a fabless company without its own manufacturing facilities, Qualcomm must internalize design capabilities to expand its business. Professor Lee commented, "Since Qualcomm does not manufacture semiconductors directly, it must aggressively hire local engineers for design if it wants to push its business forward. Similarly, other global fabless companies are also highly likely to seek talent in Korea."

This content was produced with the assistance of AI translation services.