[Market Focus] Hanmi Semiconductor Hits All-Time High on Supply to U.S. Customer

The share price of Hanmi Semiconductor hit a new all-time high. The news that the company has developed the world’s first BOC COB bonder equipment and is delivering it to overseas customers appears to have acted as a positive factor.

As of 9:54 a.m. on February 27, Hanmi Semiconductor's stock price was up 12.16% from the previous day, trading at 309,000 won. At one point during the session, it climbed as high as 326,500 won, setting a new record high.

The BOC COB bonder, for which Hanmi Semiconductor disclosed a supply contract on this day, is the world’s first bonding equipment capable of performing both the BOC and COB processes in a single machine.

Hanmi Semiconductor’s BOC COB bonder is used for the production of AI semiconductors, including stacked graphic DRAM (GDDR) and enterprise solid-state drives (eSSD).

The BOC COB bonder is scheduled to be deployed at the factory of a global customer in Gujarat, India. Within the industry, it is believed that the equipment will be supplied to Micron, a U.S. semiconductor company currently building a memory plant in Gujarat, India, with operations expected to begin soon. Hanmi Semiconductor has previously collaborated with Micron in the field of TC bonder equipment for HBM (high-bandwidth memory) as well.

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