EdgeFoundry showcased its domestically developed thermal imaging module, ThermoK, at CES 2026. Photo by EdgeFoundry
KOSDAQ-listed EdgeFoundry announced on January 20 that it had successfully participated in CES 2026, the world's largest IT and electronics exhibition, and is accelerating its entry into the global market with its self-developed thermal imaging module, ThermoK. During the exhibition, EdgeFoundry showcased its proprietary thermal imaging sensor technology at the booths of related companies.
ThermoK is an uncooled thermal imaging module independently designed by EdgeFoundry. It received significant attention from visitors for its high-resolution imaging, stable detection performance, and compact, low-power design. The module's scalability allows for immediate application in a wide range of advanced fields, including drones, intelligent surveillance and security systems, autonomous robots, and smart factories.
The company explained that, through its participation in CES 2026, it discussed strategic partnerships in the B2B and defense industries-including security and surveillance, automotive, and defense drones-with corporate and institutional representatives from around the world, moving beyond consumer channels limited to specific countries. In particular, this event was part of a strategic initiative to identify new global contract opportunities.
EdgeFoundry previously signed a supply contract worth approximately 46 billion KRW (about 35 million USD) with China's HK KEMEI Group in December for thermal imaging (IR) sensors. Starting with CES 2026, the company plans to accelerate its expansion into the North American market and intensify efforts to secure major global customers.
According to Research Nester, the global thermal imaging camera market is projected to reach approximately 600 million USD in 2025, with North America expected to account for the largest regional market share at around 31%.
An EdgeFoundry representative stated, "CES 2026 served as a stage to validate the completeness and commercial viability of our ThermoK and thermal imaging sensor technologies on a global scale," adding, "Based on the partnership proposals discussed at the exhibition, we will achieve tangible order results centered on high-growth industries such as AI, robotics, and drones."
The company continues to enhance its mass production capabilities through an integrated manufacturing system covering everything from in-house wafer processing to packaging and testing, and plans to expand its overseas market presence through collaboration with global partners following CES.
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.

