Hanmi Semiconductor Introduces Industry's First Credit System for Equipment

Hanmi Semiconductor will be the first company in the global semiconductor equipment industry to introduce a credit system. Through this initiative, the company aims to strengthen long-term partnerships with its clients and enhance its brand competitiveness.

On January 2, Hanmi Semiconductor announced the launch of the Hanmi Credit System (HCS). Under this system, when a client places an order for semiconductor equipment, 2% of the order amount will be accumulated as credits (points).

Credits are automatically accumulated once payment for the equipment is completed in full after shipment. Once a certain amount of credits has been accumulated, they can be used for the next equipment purchase. Credits are valid for five years from the date of accumulation.

Hanmi Semiconductor developed the Hanmi Credit System to express gratitude to its more than 320 global clients. The company expects that this system will help establish stable relationships with clients and secure market competitiveness.

A representative from Hanmi Semiconductor explained, "Being the first in the global semiconductor equipment industry to introduce a credit system reflects our commitment to expressing gratitude to our clients and building long-term partnerships for mutual growth." The representative added, "We will continue to provide tangible value to our clients and strengthen our competitiveness in the global market."

The roots of Hanmi Semiconductor trace back to its founder, the late Chairman Kwak Nogwon, who built up technical expertise over 14 years at Motorola Semiconductor in the United States starting in 1967. Hanmi Semiconductor currently holds the number one position worldwide in the HBM TC Bonder market, a core component for AI semiconductors, with a 71% market share. Since 2002, the company has focused on strengthening its intellectual property rights and currently holds 150 patents related to HBM equipment, including those pending. In July of last year, Hanmi Semiconductor established a mass production system for the 'TC Bonder 4' for HBM4, and by the end of this year, it plans to launch the next-generation 'Wide TC Bonder' for HBM.