Performance Superiority Confirmed in Next-Generation AI Accelerator Tests
NVIDIA Expands Demand... Progress in Supply Contract Discussions
Samsung Electronics’ next-generation high bandwidth memory (HBM4) reportedly received the highest evaluations for speed and power efficiency in tests for NVIDIA’s next-generation artificial intelligence (AI) accelerators. As a result, expectations are rising that Samsung may begin supplying HBM4 as early as the first half of next year.
According to the semiconductor industry on December 21, NVIDIA recently visited Samsung Electronics to share progress on HBM4 system-in-package testing. During the meeting, it was reported that Samsung’s HBM4 outperformed other memory manufacturers’ products in terms of operating speed and power efficiency.
NVIDIA’s projected demand for Samsung’s HBM4 next year is also said to have exceeded Samsung’s internal expectations. Industry analysts believe that expanding HBM4 supply could significantly contribute to Samsung’s improved performance.
Samsung Electronics Chairman Jay Y. Lee is shaking hands with Jensen Huang, CEO of NVIDIA, at the GeForce Gamer Festival held at the K-POP Square in COEX, Gangnam-gu, Seoul, on the afternoon of the 30th. 2025.10.30 Photo by Cho Yongjun
Taking into account the expansion schedule and production capacity of the P4 line in Pyeongtaek, Samsung Electronics is expected to sign supply contracts in the first quarter of next year and begin full-scale shipments starting in the second quarter.
An industry official said, “Unlike with HBM3E, Samsung Electronics is rapidly advancing the technological maturity of HBM4,” adding, “There are expectations for visible results next year.”
However, SK hynix reportedly completed preparations for HBM4 mass production at the end of September last year and is currently supplying paid samples to NVIDIA. In terms of mass production timing, SK hynix is estimated to be about three months ahead of Samsung Electronics. Still, compared to the nearly one-year gap seen with HBM3E, the difference has narrowed significantly.
With full-scale mass production scheduled to begin after the second quarter of next year, there is growing speculation that Samsung Electronics, which received high marks at the system-in-package stage, could secure additional supply volumes.
System-in-package technology integrates the graphics processing unit (GPU), memory, interposer, power chips, and more into a single package, serving as the final stage that comprehensively verifies speed, heat, power, and signal stability.
Meanwhile, Samsung Electronics recently reclaimed the No. 2 spot in the HBM market after three quarters. According to market research firm Counterpoint Research, Samsung’s market share based on third-quarter revenue this year was 22%, ranking second behind SK hynix at 57%. Micron followed with a 21% share.
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