Performance Superiority Confirmed in Next-Generation AI Accelerator Tests
NVIDIA Expands Demand... Progress in Supply Contract Discussions
Samsung Electronics' next-generation high-bandwidth memory, HBM4, reportedly received the highest marks in speed and power efficiency during tests for NVIDIA's upcoming AI accelerators. As a result, there are growing expectations that Samsung may begin supplying HBM4 as early as the first half of next year.
According to the semiconductor industry on December 21, NVIDIA recently visited Samsung Electronics to share the progress of HBM4 system-in-package testing. During this meeting, it was conveyed that Samsung's HBM4 achieved the best performance in terms of operating speed and power efficiency among all memory manufacturers.
It is also reported that NVIDIA's projected demand for Samsung Electronics' HBM4 next year exceeded internal expectations. Industry experts analyze that the expansion of HBM4 supply is highly likely to contribute to improved earnings for Samsung Electronics.
Samsung Electronics Chairman Jay Y. Lee is shaking hands with Jensen Huang, CEO of NVIDIA, at the GeForce Gamer Festival held at the K-POP Square in COEX, Gangnam-gu, Seoul, on the afternoon of October 30, 2025. Photo by Jo Yongjun
Taking into account the expansion schedule and production capacity of the Pyeongtaek P4 production line, Samsung Electronics is expected to sign supply contracts in the first quarter of next year and begin full-scale supply in the second quarter.
An industry insider stated, "Unlike with HBM3E, there is widespread recognition that Samsung Electronics has rapidly improved its technological completeness in HBM4 development," adding, "There are expectations for tangible results next year."
However, SK hynix reportedly completed preparations for HBM4 mass production at the end of September last year and is currently supplying paid samples to NVIDIA. Some in the industry assess that SK hynix is about three months ahead of Samsung Electronics in terms of mass production timing. Nevertheless, compared to the gap of nearly one year during the HBM3E era, the difference has significantly narrowed.
In particular, with full-scale mass production scheduled to begin after the second quarter of next year, there is speculation that Samsung Electronics, which received high marks at the system-in-package stage, may secure additional supply volume.
System-in-package is a technology that integrates graphics processing units, memory, interposers, and power chips into a single package, and is considered the final stage where speed, heat generation, power, and signal stability are comprehensively tested.
Meanwhile, Samsung Electronics recently regained the No. 2 position in the high-bandwidth memory market after three quarters. According to market research firm Counterpoint Research, Samsung Electronics' market share in the third quarter of this year was 22% based on sales, ranking second behind SK hynix at 57%. Micron followed with a 21% share.
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