Dow and LG Electronics to Jointly Develop Immersion Cooling Solutions for Data Center Heat Management

Supplying High-Purity Propylene Glycol-Based Coolant
To Be Applied to LG Electronics' Coolant Distribution Unit

Global materials company Dow is partnering with LG Electronics to jointly develop liquid cooling solutions for artificial intelligence (AI) data centers.

Dow and LG Electronics announced on the 10th that they had signed a memorandum of understanding (MOU) for collaboration on data center cooling solution development at the 'Data Center World Asia 2025' event held at Marina Bay Sands in Singapore on the 8th.

Dow signed an MOU for collaboration on data center cooling solution development with LG Electronics on the 8th in Singapore. Eddie Dong, Sales Director of Dow Industrial Solutions Asia Pacific (fifth from the left), and O Se-gi, Vice President and Head of LG Electronics ES Research Lab (sixth from the left), are posing for a commemorative photo after signing the MOU. Dow

Under this agreement, the two companies will collaborate in various areas, including joint research and development (R&D) of data center cooling and efficiency technologies, new data center pilot projects, and joint marketing. They also plan to establish a step-by-step roadmap from technology development to commercialization, aiming to strengthen their competitiveness in the global market.

Dow will supply LG Electronics with 'Dowfrost LC,' a heat transfer fluid dedicated to liquid cooling. Manufactured with over 99.8% high-purity propylene glycol (PG), this product provides stable thermal management and corrosion protection for metals in high-density server environments, and is characterized by reducing long-term maintenance burdens.

LG Electronics plans to apply Dow's material to its own coolant distribution unit (CDU) to enhance product efficiency. Having already secured high-efficiency CDU technology, LG Electronics intends to further expand its presence in the global market.