Samsung Electro-Mechanics is accelerating its next-generation glass substrate business by recruiting semiconductor packaging specialists. On August 3, Samsung Electro-Mechanics announced that it has appointed Kang Duan, a senior engineer with 17 years of experience at Intel and an expert in semiconductor packaging, as vice president.
Vice President Kang, a Chinese-American, is a graduate of the California Institute of Technology (Caltech) and is recognized as a global expert in next-generation packaging technology. Last year, he was selected as Intel's "Inventor of the Year," and is particularly known for leading the development of glass substrate technology suitable for high-performance AI semiconductors.
Starting this month, Vice President Kang will oversee technology marketing and application engineering at Samsung Electro-Mechanics America. He will be responsible for developing new business related to glass substrates, analyzing technology trends in the packaging market, establishing technology roadmaps, and formulating strategies to engage with global customers.
Glass substrates are attracting attention as a key material for high-performance AI semiconductors because, compared to conventional plastic substrates, they are thinner and have greater flatness, which reduces circuit distortion and improves data transmission speed and power efficiency.
Samsung Electro-Mechanics is currently operating a glass substrate pilot line and plans to conduct sampling for two to three major U.S. big tech companies this year. The target for mass production is 2027.
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