High-Performance 'Silver Paste' for Power Semiconductors Developed
Enhanced with Japanese Craftsmanship: Improved Heat Resistance and Storage Convenience
Shin Hakcheol: "Differentiated Competitiveness in the Global Market"
LG Chem has joined forces with Japanese ceramics specialist Noritake to jointly develop an adhesive for next-generation automotive power semiconductors. With the 'Silver Paste,' which remains stable even at high temperatures and is convenient to store and transport, the company plans to accelerate its entry into the global automotive electronics components market.
On June 16, LG Chem announced that it has jointly developed a high-performance adhesive with Noritake, which is used to bond power semiconductor chips and substrates in automobiles. Silver Paste is an adhesive containing fine silver (Ag) particles and provides stable bonding performance at higher temperatures compared to conventional soldering methods.
On the 16th, LG Chem announced that it has jointly developed a high-performance adhesive used to bond power semiconductor chips and substrates in automobiles together with Noritake. LG Chem
Recently, the rapid expansion of electric vehicles and advances in autonomous driving technology have led to a surge in demand for power semiconductors that can withstand greater amounts of power and heat. However, traditional soldering methods can lose performance in high-temperature environments reaching up to 300 degrees Celsius, making alternative technologies necessary. As a result, Silver Paste, which is highly heat-resistant and offers excellent heat dissipation, is gaining attention.
The newly developed adhesive is the result of combining LG Chem's particle design technology with Noritake's expertise in dispersion and manufacturing. Notably, while previous products required freezing for storage, this new adhesive can be stored at room temperature for up to six months. This makes transportation and on-site storage easier, and it is expected to see increased use in actual manufacturing environments.
LG Chem and Noritake plan to continue developing next-generation adhesive materials by integrating their respective technologies. The market for Silver Paste used in power semiconductors is projected to grow from approximately 300 billion KRW in 2025 to 850 billion KRW by 2030.
Shin Hakcheol, Vice Chairman of LG Chem, stated, "Based on LG Chem's long-accumulated material technology and design capabilities, we have been providing customized solutions for a variety of fields, including automotive electronic components," and emphasized, "Through this collaboration with Noritake, we will secure differentiated competitiveness in the global automotive adhesive market."
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