[Taiwan Chip News] TSMC Delays Adoption of New EUV Equipment... Samsung and Intel in Pursuit

Used in Sub-2-Nanometer Ultra-Precision Lithography Process
TSMC: "No Plans for Adoption Yet"
TSMC Remains Cautious About Equipment Costing Over $400 Million
Competitors Targeting the Ultra-Precision Semiconductor Market

TSMC, the Taiwanese foundry (semiconductor contract manufacturing) company, is deliberating whether to introduce the new 'high numerical aperture (NA)' extreme ultraviolet (EUV) equipment for its next-generation advanced semiconductor process technology. As competitors such as Samsung Electronics and Intel are successively adopting this equipment, they are seeking opportunities to catch up with TSMC in the sub-2-nanometer semiconductor market.

ASML engineers are inspecting the high-NA EUV lithography machine installed at ASML headquarters in the Netherlands. ASML.

According to local media such as Taiwan Economic Daily News on June 2, TSMC Senior Vice President Zhang Xiaochang stated at the "2025 Technology Forum" held in Amsterdam, Netherlands, on May 27 (local time), that when asked about plans to introduce high-NA EUV equipment for the upcoming A14 (1.4-nanometer) process and next-generation processes, "We have not yet found a convincing reason." He added, "The TSMC A14 process is very stable even without high-NA EUV," and explained, "Our R&D organization is continuously seeking ways to extend the lifespan of the equipment currently in use."

EUV equipment is used in the lithography process to draw semiconductor circuits. In particular, for advanced process technology below 7 nanometers, EUV equipment exclusively supplied by the Dutch equipment company ASML is essential. High-NA EUV is an upgraded version of the existing EUV equipment, and it is necessary for implementing ultra-fine circuits below 2 nanometers.

The reason TSMC is hesitant to introduce the equipment appears to be the price. The high-NA EUV equipment costs more than $400 million (about 550 billion won) per unit, which is more than twice as expensive as the most expensive equipment currently used in semiconductor manufacturing. Semiconductor manufacturers are carefully considering whether the processing speed and precision offered by this equipment can truly offset such high costs.

ASML has announced that a total of five high-NA EUV machines have been shipped worldwide. Customers include Intel, TSMC, and Samsung Electronics. Christophe Fouquet, CEO of ASML, recently stated during an earnings announcement that "customers are preparing for mass production tests in 2026?2027."

Previously, Intel announced plans to introduce high-NA EUV equipment for its future 14A process. Through this, the company aims to revive its foundry business and enhance its competitiveness. Intel has even planned to import around five units, which is the annual production capacity of ASML, effectively attempting a so-called "sweep."

Samsung Electronics also introduced this equipment to its Hwaseong campus earlier this year, taking steps to catch up with TSMC. SK Hynix is also scheduled to introduce high-NA EUV equipment in 2026. As competitors prepare for ultra-fine circuit implementation, competition in the sub-2-nanometer semiconductor process market is expected to intensify. TSMC reportedly secured a 60% yield in its 2-nanometer pilot production at the end of last year.

Taiwan Economic Daily News = Reporter Ye Tingjun / Translation = Asia Economy

*This column is published as part of a strategic partnership between Asia Economy and Taiwan Economic Daily News.