Jeff Fisher, NVIDIA Vice President, Visits Booth
SK hynix Supplies 12-Layer HBM4 Samples
Samsung Also Unveils Chip for RTX5090 at Booth
"Congrats on HBM4 Sample!"
Jeff Fisher, Senior Vice President of NVIDIA's Graphics Processing Unit (GPU) Business Unit, showed great interest in SK hynix's next-generation High Bandwidth Memory (HBM4).
On the 18th (local time), Fisher visited the SK hynix booth at the 'GTC 2025' event held in San Jose, California, USA, and personally left this congratulatory message on the HBM4 sample presentation materials.
Jeff Fisher, Senior Vice President of NVIDIA's GPU Business Unit, left a handwritten signature and note at the SK Hynix booth during 'GTC 2025' held on the 18th (local time) in San Jose, California, USA. Photo by Park Joon-yi
From the morning of the day, various company booths opened in line with Jensen Huang, NVIDIA CEO's keynote speech at GTC 2025. Among domestic memory semiconductor companies, SK hynix and Samsung Electronics also opened booths at GTC to promote their products.
At the booth held that day, SK hynix showcased a 12-layer model of the 6th generation HBM, HBM4. SK hynix is the world's first to mass-produce the 12-layer HBM3E product and supply it to NVIDIA. Currently, they have started shipping the 12-layer HBM4 product and are providing samples to key customers.
Although SK hynix did not specify the customers, during the morning keynote speech, Jensen Huang unveiled 'Rubin,' the next-generation artificial intelligence (AI) semiconductor that will first apply HBM4, leading to speculation that SK hynix's HBM4 will be mounted on Rubin.
Coincidentally, Fisher's visit to deliver congratulations also raises expectations for cooperation between the two companies. Given that NVIDIA has been a major customer whenever SK hynix released new products, it is interpreted that NVIDIA is likely to be a key customer for HBM4 as well.
On the 18th (local time) in San Jose, California, USA, Samsung Electronics, participating in 'GTC 2025,' is exhibiting a sample of Samsung's memory chip GDDR7, which will be installed in NVIDIA's new graphics card RT50 series, the RTX5090. Photo by Junyi Park
On the same day, Samsung Electronics also set up a booth at the convention center, displaying models of HBM3E, HBM3, and HBM4. Industry insiders expect Samsung Electronics to start supplying improved HBM3E products to major customers, including NVIDIA, from the end of this month.
At this booth, Samsung Electronics unveiled its memory chip GDDR7, which will be mounted on NVIDIA's new graphics card RT50 series, RTX5090, announced in January. Although it was previously known that Samsung's GDDR7 was mounted on the RTX50 series, this is the first time Samsung has exhibited it externally.
Meanwhile, Jeon Young-hyun, head of Samsung Electronics' Device Solutions (DS) division, stated at the regular shareholders' meeting held that day, "Samsung's HBM3E (5th generation) will play a leading role in the market as early as the second quarter or at the latest in the second half of the year."
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