Subsidiary Established in Q3 Last Year
Mass Production of HBM and More Set for Second Half of 2028
SK Hynix has appointed Vice President Lee Woong-seon as the head of its semiconductor packaging base being built in the United States.
According to industry sources on the 17th, SK Hynix established the West Lafayette LLC corporation in Indiana, USA, in the third quarter of last year and appointed Vice President Lee as its representative.
Vice President Lee joined SK Hynix in 2005 and has been responsible for PKG (packaging) product research and development (R&D), wafer-level packaging (WLP) manufacturing technology, and contributed to the development and mass production of high bandwidth memory (HBM).
Earlier, in April last year, SK Hynix announced plans to invest $3.87 billion (approximately 5.4 trillion KRW) to build an advanced packaging production base for artificial intelligence (AI) memory in West Lafayette, Indiana, and to collaborate on semiconductor research and development with local research institutions such as Purdue University.
The Indiana plant is expected to begin mass production of next-generation HBM and other AI memory products from the second half of 2028.
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