[Conference Call] SK Hynix: "HBM4 16-Layer Expected to Ship in Second Half of Next Year"

SK Hynix Yonhap News

On the morning of January 23, following the announcement of its fourth-quarter results for last year, SK Hynix stated at a briefing that regarding HBM4, its sixth-generation high-bandwidth memory (HBM), "We will begin supplying 12-layer products, and the 16-layer products will be manufactured in accordance with customer requirements." The company added, "The 16-layer products are expected to be shipped in the second half of next year."