Hanmi Semiconductor Chairman Gwak Dong-shin Attends Micron Singapore New Plant Groundbreaking Ceremony

Hanmi Semiconductor announced on the 8th that Chairman Gwak Dong-shin was invited to the groundbreaking ceremony of Micron Technology's new high-bandwidth memory (HBM) packaging plant in Singapore.

Chairman Gwak, along with executives, attended the Micron groundbreaking ceremony held in Woodlands, Singapore. The new Micron plant is expected to be completed around 2027 as a high-spec HBM production facility applied to AI semiconductor growth centers such as Nvidia and Broadcom.

Micron currently produces HBM at its Taiwan plant. The Singapore HBM-dedicated plant, along with facilities in Idaho, USA next year, and in New York, USA and Hiroshima, Japan in 2027, will also operate HBM production lines.

Sanjay Mehrotra, Micron’s CEO, stated during the Q3 earnings conference call last year, "We aim to raise our HBM market share to the 20% range this year." Considering last year's market share was about 9%, aggressive expansion investments are expected to continue.

According to market research firm TrendForce, Micron plans to expand its HBM production capacity from 20,000 wafers per month at the end of last year to 60,000 wafers per month by the end of this year. Through this, Micron aims to catch up with competitors and increase its market share.

Hanmi Semiconductor is the world’s number one company in market share for TC bonders used in HBM production. Since April last year, it has started supplying to Micron, and it is expected that Hanmi Semiconductor’s TC bonder sales will increase alongside Micron’s HBM expansion.

Lee Yong-hwan, a researcher at CGSI Securities, said in a report on the 10th of last month, "SK Hynix and Micron Technology will actively expand HBM production capacity," and "This will play a decisive role in driving the increase in Hanmi Semiconductor’s TC bonder sales." He added, "Hanmi Semiconductor will greatly benefit from Micron’s HBM production capacity expansion and Micron’s orders for Nvidia’s data center GPUs."

Founded in 1980, Hanmi Semiconductor is a global company with 44 years of experience and know-how in the global semiconductor equipment market. Over the past 10 years, its export ratio has averaged over 76% of sales, and it has about 320 customers worldwide. Since establishing its Intellectual Property Department in 2002, the dedicated team of about 10 specialists has filed over 120 patents related to HBM production equipment, holding unparalleled technology globally.