Comprehensive Collection of Products Leading the AI Era
"Providing Irreplaceable Value"
SK Hynix announced on the 3rd that it will participate in CES 2025, the world's largest electronics and IT exhibition held in Las Vegas, USA, from the 7th to the 10th (local time), to unveil its artificial intelligence (AI) memory technology. C-level executives including CEO Kwak No-jeong, AI Infrastructure President Kim Ju-seon, and Development General Manager Ahn Hyun will attend.
CEO Kwak No-jeong said, "The changes triggered by AI are expected to accelerate further this year. Our company plans to lead the customized HBM market that meets diverse customer demands by mass-producing the 6th generation HBM (HBM4) in the second half of this year." He added, "SK Hynix will continue to present new possibilities in the AI era based on technological innovation and do its best to provide irreplaceable value to customers."
At this event, SK Hynix will showcase a sample of the 5th generation HBM (HBM3E) 16-layer product, officially developed last November. This product applies the advanced MR-MUF process to achieve the industry's highest 16 layers while controlling chip warpage and maximizing heat dissipation performance.
Aerial view of SK hynix exhibition at the world's largest electronics and IT trade show, 'CES 2025'. Photo by SK hynix
SK Hynix and its subsidiary Solidigm will also exhibit a lineup of high-capacity, high-performance enterprise solid-state drive (eSSD) products. Along with Solidigm's 122TB D5-P5336 model, SK Hynix will introduce its recently developed 61TB product based on quad-level cell (QLC) technology. President Ahn Hyun said, "Following Solidigm, SK Hynix also succeeded in developing a 61TB QLC-based product last December, so we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market."
Memory products such as LPCAMM2 and ZUFS 4.0, which are perfectly suited for edge devices utilizing AI, will also be showcased. Additionally, CMM-Ax and AiMX products, which utilize Compute Express Link (CXL) technology and Processing In Memory (PIM) technology, are gaining attention as essential technologies for new data centers. CMM-Ax is expected to enhance server performance and significantly improve energy efficiency by storing large amounts of data while performing computations.
President Kim Ju-seon stated, "At this CES, we will broadly showcase representative AI memory products such as HBM and eSSD, as well as solutions optimized for on-device AI and next-generation AI memory." He added, "Through this, we will widely promote our technological competitiveness in preparing for the future as a 'Full Stack AI Memory Provider.'"
At this CES, SK Hynix plans to operate a joint exhibition hall with affiliates including SK Telecom, SKC, and SK Enmove under the theme "Creating a Sustainable Future with Innovative AI Technology."
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