Doosan Testna Absorbs Subsidiary Engion in Merger

Proactive Response to Turnkey Demand in System Semiconductor Backend Processing
Enhancing Operational Efficiency and Sales Competitiveness

Doosan Tesna Seoanseong Plant. Photo by Doosan Tesna

Doosan Testna, the domestic market leader in system semiconductor wafer testing, announced on the 20th that it will absorb and merge its subsidiary Engion.

Doosan Testna, which owns 100% of Engion's shares, will proceed with a small-scale merger without issuing new shares, and the scheduled merger date is February 28, 2025.

Engion, acquired by Doosan Testna in February, is a specialized company in outsourced semiconductor assembly & test (OSAT) for image sensor (CIS: CMOS Image Sensor) semiconductors. It possesses semiconductor post-processing technologies such as chip sorting and reconstruction, wafer back grinding, and sawing. Additionally, Engion has a diverse product portfolio including silicon carbide (SiC) power semiconductors and display driver ICs (DDI), which have recently gained attention, and it is expected that business synergies with Doosan Testna will expand in the future.

A Doosan Testna representative stated, "Through this merger, we expect to enhance our ability to respond to turnkey post-processing orders, improve operational efficiency, strengthen sales competitiveness, and also secure new customers."