ElsquareS Successfully Completes PSPI Reliability Testing

Semiconductor material company L-Square S announced on the 20th that it has successfully completed the development of a photosensitive polyimide (PSPI) material to be used in the production line of glass core substrates for semiconductor packaging produced by its U.S. glass substrate customer. The product recently completed reliability testing, proving its potential for commercial use. L-Square S is a semiconductor component material company jointly established by LTC and Leaders Cosmetic.

PSPI is used as a passivation layer for glass core substrates in semiconductor packaging, playing a key role in protecting the product surface, preventing corrosion and oxidation. In particular, L-Square S's PSPI offers a new alternative in the advanced materials market, which has been monopolized by Japan, securing global competitiveness.

L-Square S's PSPI does not use PFA (perfluorinated compounds), meeting environmental regulations of the European Union (EU) and the United States, and boasts high sensitivity, low dielectric loss, excellent heat resistance, and film properties. Furthermore, based on technology verified in the display field, it is applied to the advanced semiconductor packaging sector, providing differentiated quality and performance compared to existing materials.

The U.S. glass substrate customer plans to begin full-scale mass production using this material starting next year. L-Square S expects PSPI sales to increase significantly through this.